Effect of Cu and Heat Treatment on the Microstructure and Properties of 6101 Aluminum Alloy

IF 2.2 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Fuwei Kang, Jiahao Li, Enhao Wang, Shilei Liu, Xiankai Wang, Bingpeng Zhang, Wei Jiang
{"title":"Effect of Cu and Heat Treatment on the Microstructure and Properties of 6101 Aluminum Alloy","authors":"Fuwei Kang, Jiahao Li, Enhao Wang, Shilei Liu, Xiankai Wang, Bingpeng Zhang, Wei Jiang","doi":"10.1007/s11665-024-10066-9","DOIUrl":null,"url":null,"abstract":"<p>The effects of Cu addition (0.01, 0.1, 0.5 and 1 wt.%) and heat treatment on the microstructure, electrical conductivity and mechanical properties of 6101 aluminum were investigated. Compared with alloys with lower Cu content, the appropriate addition of Cu is conducive to refinement of grains, thereby increasing the strength of 6101 aluminum alloy. When the Cu addition was increased from 0.01 to 1 wt.%, the hardness of the alloy increased by 10.3% and the tensile strength by 44.7%. However, the electrical conductivity of the alloy decreased with the addition of Cu. The alloys were rolled to further improve their properties. The rolled sheet of the alloy underwent solid solution treatment and aging strengthening, resulting in enhanced mechanical properties and electrical conductivity. The results showed that the conductivity of the alloys increased with the increase of the etching temperature and holding time, with an average increase of 5.8% for the four combinations of gold. In order to achieve a comprehensive match between the electrical conductivity and mechanical properties of the alloy material, the heat treatment process was selected with the addition of 0.5 wt.% Cu element, solid solution temperature of 545 °C with a holding time of 0.75 h, and aging temperature of 185 °C with a holding time of 8 h. By incorporating Cu and following this heat treatment process, the tensile strength of 6101 aluminum alloy sheet can reach 209.79 MPa, while maintaining an electrical conductivity above 53.5% IACS.</p>","PeriodicalId":644,"journal":{"name":"Journal of Materials Engineering and Performance","volume":"19 1","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2024-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Engineering and Performance","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1007/s11665-024-10066-9","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
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Abstract

The effects of Cu addition (0.01, 0.1, 0.5 and 1 wt.%) and heat treatment on the microstructure, electrical conductivity and mechanical properties of 6101 aluminum were investigated. Compared with alloys with lower Cu content, the appropriate addition of Cu is conducive to refinement of grains, thereby increasing the strength of 6101 aluminum alloy. When the Cu addition was increased from 0.01 to 1 wt.%, the hardness of the alloy increased by 10.3% and the tensile strength by 44.7%. However, the electrical conductivity of the alloy decreased with the addition of Cu. The alloys were rolled to further improve their properties. The rolled sheet of the alloy underwent solid solution treatment and aging strengthening, resulting in enhanced mechanical properties and electrical conductivity. The results showed that the conductivity of the alloys increased with the increase of the etching temperature and holding time, with an average increase of 5.8% for the four combinations of gold. In order to achieve a comprehensive match between the electrical conductivity and mechanical properties of the alloy material, the heat treatment process was selected with the addition of 0.5 wt.% Cu element, solid solution temperature of 545 °C with a holding time of 0.75 h, and aging temperature of 185 °C with a holding time of 8 h. By incorporating Cu and following this heat treatment process, the tensile strength of 6101 aluminum alloy sheet can reach 209.79 MPa, while maintaining an electrical conductivity above 53.5% IACS.

Abstract Image

铜和热处理对 6101 铝合金微观结构和性能的影响
研究了 Cu 添加量(0.01、0.1、0.5 和 1 wt.%)和热处理对 6101 铝的微观结构、导电性和机械性能的影响。与铜含量较低的合金相比,适当添加铜有利于晶粒细化,从而提高 6101 铝合金的强度。当铜的添加量从 0.01 wt.% 增加到 1 wt.% 时,合金的硬度提高了 10.3%,抗拉强度提高了 44.7%。然而,合金的导电性随着铜的添加而降低。为了进一步提高合金的性能,对合金进行了轧制。轧制的合金板材经过固溶处理和时效强化后,机械性能和导电率都得到了提高。结果表明,合金的导电率随着蚀刻温度和保温时间的增加而增加,四种金组合的平均增加率为 5.8%。为了实现合金材料导电性和机械性能的全面匹配,选择了添加 0.5 wt.% Cu 元素、固溶温度为 545 ℃、保温时间为 0.75 h,以及时效温度为 185 ℃、保温时间为 8 h 的热处理工艺。
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来源期刊
Journal of Materials Engineering and Performance
Journal of Materials Engineering and Performance 工程技术-材料科学:综合
CiteScore
3.90
自引率
13.00%
发文量
1120
审稿时长
4.9 months
期刊介绍: ASM International''s Journal of Materials Engineering and Performance focuses on solving day-to-day engineering challenges, particularly those involving components for larger systems. The journal presents a clear understanding of relationships between materials selection, processing, applications and performance. The Journal of Materials Engineering covers all aspects of materials selection, design, processing, characterization and evaluation, including how to improve materials properties through processes and process control of casting, forming, heat treating, surface modification and coating, and fabrication. Testing and characterization (including mechanical and physical tests, NDE, metallography, failure analysis, corrosion resistance, chemical analysis, surface characterization, and microanalysis of surfaces, features and fractures), and industrial performance measurement are also covered
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