Effect of Y on the microstructure and physical properties of Cu-Zr-Mg-Y alloys

IF 3.8 2区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Vacuum Pub Date : 2024-09-14 DOI:10.1016/j.vacuum.2024.113651

引用次数: 0

Abstract

This work presents the development of two novel Cu-Zr-Mg(Y) alloys. The alloys were prepared using vacuum melting and show good conductivity and mechanical properties after solution treatment+60 % cold rolling + aging at 450 °C for 60 min.

The measurement results reveal that the Cu-Zr-Mg alloy has a microhardness of 165 ± 5 HV, an electrical conductivity of 68.5 ± 0.2 % IACS and a tensile strength of 483 ± 15 MPa while the Cu-Zr-Mg-Y alloy has a microhardness of 172 ± 6 HV, an electrical conductivity of 67.9 ± 0.2 % IACS and a tensile strength of 503 ± 12 MPa.

The addition of Y promotes the recovery and recrystallization of the alloys and causes the refinement of the grain size. The appearance of copper texture is the reason why the Cu-Zr-Mg-Y alloy has higher tensile strength in the rolling direction. The main phases of the Cu-Zr-Mg-Y alloy consist of Cu₅Zr and a small amount of Mg₂₄Y₅. The increment in precipitation strengthening is primarily attributed to the coherent Cu₅Zr phase within the matrix.

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Y 对 Cu-Zr-Mg-Y 合金微观结构和物理性质的影响

这项工作展示了两种新型铜-Zr-镁（Y）合金的开发。测量结果显示，Cu-Zr-Mg 合金的显微硬度为 165 ± 5 HV，导电率为 68.5 ± 0.2 % IACS，抗拉强度为 483 ± 15 MPa。测量结果显示，Cu-Zr-Mg 合金的显微硬度为 165 ± 5 HV，电导率为 68.5 ± 0.2 % IACS，抗拉强度为 483 ± 15 MPa，而 Cu-Zr-Mg-Y 合金的显微硬度为 172 ± 6 HV，电导率为 67.9 ± 0.2 % IACS，抗拉强度为 503 ± 12 MPa。铜纹理的出现是 Cu-Zr-Mg-Y 合金在轧制方向上具有较高抗拉强度的原因。Cu-Zr-Mg-Y 合金的主要相由 Cu5Zr 和少量 Mg24Y5 组成。沉淀强化的增加主要归因于基体中相干的 Cu5Zr 相。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Vacuum 工程技术-材料科学：综合

CiteScore

6.80

自引率

17.50%

发文量

审稿时长

34 days

期刊介绍： Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.