Simulation of ion beam sputtering with OKSANA and SRIM: A comparative study

IF 3.8 2区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Vacuum Pub Date : 2024-09-11 DOI:10.1016/j.vacuum.2024.113644

引用次数: 0

Abstract

The energy distributions and average energies of sputtered particles are calculated using simulation codes OKSANA and SRIM-2013. Most simulations refer to an amorphous Ni target bombarded by normally incident Ar ions of keV energies. Sputtering of Si, Ti, V and Nb targets is also considered. It is shown that SRIM can strongly overestimate the contribution of fast ejected atoms, especially for targets irradiated with lighter ions. The effect is amplified by using the surface binding energies found to fit the measured sputter yields. It is concluded that the enhanced ejection of fast particles is associated with sputtering due to backscattered ions. The role of the first collision of an incident ion with a target atom is particularly noted. A comparison of the OKSANA calculated results with the data of other codes (TRIM.SP, ACAT) and experimental data showed their reasonable agreement.

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利用 OKSANA 和 SRIM 模拟离子束溅射：比较研究

利用模拟代码 OKSANA 和 SRIM-2013 计算了溅射粒子的能量分布和平均能量。大多数模拟都是针对非晶镍靶，由正常入射的 keV 能量氩离子轰击。还考虑了 Si、Ti、V 和 Nb 靶件的溅射。结果表明，SRIM 会严重高估快速射出原子的贡献，特别是对于用较轻离子照射的靶。通过使用与测量到的溅射量相匹配的表面结合能，这种效应被放大了。结论是，快速粒子喷射的增强与反向散射离子引起的溅射有关。入射离子与靶原子的第一次碰撞的作用尤其值得注意。将 OKSANA 的计算结果与其他代码（TRIM.SP、ACAT）的数据和实验数据进行比较后发现，两者的结果非常吻合。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Vacuum 工程技术-材料科学：综合

CiteScore

6.80

自引率

17.50%

发文量

审稿时长

34 days

期刊介绍： Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.