Ionization of copper in gas and gasless modes of continuous high-power magnetron sputtering

IF 3.8 2区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Vacuum Pub Date : 2024-09-14 DOI:10.1016/j.vacuum.2024.113649

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Abstract

The results of studies of magnetron sputtering of copper at discharge currents from 2 to 15 A in a 76 mm diameter planar magnetron are presented. In addition to the standard gas mode at an argon pressure of 0.12 Pa, a gasless mode was also implemented in which no argon was supplied to the vacuum chamber and the base pressure was 1·10⁻³ Pa. The stable gasless mode is realized at a discharge current higher than 8 A. The electrical discharge parameters as well as the copper sputtering rate, the ion current density on the substrate and the degree of ionization of the sputtered target material were measured and compared for the two modes mentioned. The plasma composition was also measured by optical spectrometry. The experimental data were used to calculate the density and composition of the neutral and ion fluxes to the substrate. It is shown that the gasless mode provides a higher ion current density on the probe and a higher degree of ionization of the sputtered copper compared to the gas mode at the same discharge current. The degree of ionization of the sputtered material reaches 14–15 % in gasless mode, whereas in gas mode it varies from 2 to 13 % depending on the discharge current.

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连续大功率磁控溅射的有气和无气模式下的铜电离

本文介绍了在直径为 76 毫米的平面磁控管中以 2 至 15 安培的放电电流对铜进行磁控溅射的研究结果。除了氩气压力为 0.12 Pa 的标准气体模式外，还采用了无气模式，即不向真空室提供氩气，基础压力为 1-10-3 Pa。对上述两种模式的放电参数以及铜溅射率、基片上的离子电流密度和溅射靶材料的电离程度进行了测量和比较。此外，还通过光学光谱仪测量了等离子体的成分。实验数据用于计算中性通量和离子通量的密度和组成，以及基片的离子通量。实验结果表明，在相同的放电电流下，无气模式与有气模式相比，探针上的离子电流密度更高，溅射铜的电离程度更高。在无气模式下，溅射材料的离子化程度达到 14-15%，而在有气模式下，根据放电电流的不同，离子化程度从 2% 到 13% 不等。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Vacuum 工程技术-材料科学：综合

CiteScore

6.80

自引率

17.50%

发文量

审稿时长

34 days

期刊介绍： Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.