Thermal conductivity of epoxy/multilayered graphene composites prepared with different curing agents

IF 3.1 2区化学 Q2 CHEMISTRY, ANALYTICAL

Thermochimica Acta Pub Date : 2024-09-10 DOI:10.1016/j.tca.2024.179866

Miyuki Harada, Masafumi Horimoto, Tomoki Tsukuda

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Abstract

Epoxy/multilayer graphene (ML-graphene) composites were prepared using different curing agents to control the graphene dispersion by changing the curing reactivity. With increasing initial reactivity, the aggregation size of the ML-graphene decreased and their thermal conductivity increased. In particular, the thermal conductivity of the composite prepared with p-phenylenediamine showed a maximum value of 1.46 W/(m·K) at 25 wt% ML-graphene loading because of the highest initial curing reactivity. The application of a magnetic field led to graphene alignment along the applied field, resulting in two times higher thermal conductivity than that of the corresponding system without magnetic field. The relationship between the interfacial affinity for epoxy/graphene and thermal conductivity was also investigated. As a result, resulting in a biphenyl epoxy composite showed higher thermal conductivity (6.17 W/(m·K)) than that of the bisphenol-A epoxy composite. This is derived that the π-conjugated and planar structure of biphenyl epoxy can easily interact with the surface of graphene.

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使用不同固化剂制备的环氧树脂/多层石墨烯复合材料的导热性能

使用不同的固化剂制备了环氧树脂/多层石墨烯（ML-石墨烯）复合材料，通过改变固化反应活性来控制石墨烯的分散。随着初始反应活性的增加，多层石墨烯的聚集尺寸减小，导热系数增加。特别是用对苯二胺制备的复合材料，由于初始固化反应活性最高，在石墨烯含量为 25 wt% 时，热导率达到最大值 1.46 W/(m-K)。磁场的施加导致石墨烯沿着施加的磁场排列，从而使热导率比相应的无磁场体系高出两倍。此外，还研究了环氧树脂/石墨烯界面亲和性与导热性之间的关系。结果表明，联苯环氧复合材料的热导率（6.17 W/(m-K)）高于双酚 A 环氧复合材料。这说明联苯环氧的 π 共轭和平面结构很容易与石墨烯表面相互作用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Thermochimica Acta 化学-分析化学

CiteScore

6.50

自引率

8.60%

发文量

210

审稿时长

40 days

期刊介绍： Thermochimica Acta publishes original research contributions covering all aspects of thermoanalytical and calorimetric methods and their application to experimental chemistry, physics, biology and engineering. The journal aims to span the whole range from fundamental research to practical application. The journal focuses on the research that advances physical and analytical science of thermal phenomena. Therefore, the manuscripts are expected to provide important insights into the thermal phenomena studied or to propose significant improvements of analytical or computational techniques employed in thermal studies. Manuscripts that report the results of routine thermal measurements are not suitable for publication in Thermochimica Acta. The journal particularly welcomes papers from newly emerging areas as well as from the traditional strength areas: - New and improved instrumentation and methods - Thermal properties and behavior of materials - Kinetics of thermally stimulated processes