Effect of Mo and ZrO2 nanoparticles addition on interfacial properties and shear strength of Sn58Bi/Cu solder joint

IF 4.7 1区材料科学 Q1 METALLURGY & METALLURGICAL ENGINEERING

Transactions of Nonferrous Metals Society of China Pub Date : 2024-08-01 DOI:10.1016/S1003-6326(24)66564-7

Amares SINGH , Hui Leng CHOO , Wei Hong TAN , Rajkumar DURAIRAJ

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引用次数: 0

Abstract

The influence of Mo and ZrO₂ nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated. The interfacial microstructures of Sn58Bi/Cu, Sn58Bi + Mo/Cu and Sn58Bi + ZrO₂/Cu solder joints were analysed using a scanning electron microscope (SEM) coupled with energy dispersive X-ray (EDX) and the X-ray diffraction (XRD). Intermetallic compounds (IMCs) of MoSn₂ are detected in the Sn58Bi + Mo/Cu solder joint, while SnZr, Zr₅Sn₃, ZrCu and ZrSn₂ are detected in Sn58Bi + ZrO₂/Cu solder joint. IMC layers for both composite solders comprise of Cu₆Sn₅ and Cu₃Sn. The SEM images of these layers were used to measure the IMC layer’s thickness. The average IMC layer’s thickness is 1.4431 µm for Sn58Bi + Mo/Cu and 0.9112 µm for Sn58Bi + ZrO₂/Cu solder joints. Shear strength of the solder joints was investigated via the single shear lap test method. The average maximum load and shear stress of the Sn58Bi + Mo/Cu and Sn58Bi + ZrO₂/Cu solder joints are increased by 33% and 69%, respectively, as compared to those of the Sn58Bi/Cu solder joint. By comparing both composite solder joints, the latter prevails better as adding smaller sized ZrO₂ nanoparticles improves the interfacial properties granting a stronger solder joint.

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添加 Mo 和 ZrO2 纳米粒子对 Sn58Bi/Cu 焊点界面性能和剪切强度的影响

研究了添加 Mo 和 ZrO2 纳米粒子对 Sn58Bi 焊点的界面性能和剪切强度的影响。使用扫描电子显微镜（SEM）结合能量色散 X 射线（EDX）和 X 射线衍射（XRD）分析了 Sn58Bi/Cu、Sn58Bi + Mo/Cu 和 Sn58Bi + ZrO2/Cu 焊点的界面微结构。在 Sn58Bi + Mo/Cu 焊点中检测到了 MoSn2 金属间化合物（IMC），而在 Sn58Bi + ZrO2/Cu 焊点中检测到了 SnZr、Zr5Sn3、ZrCu 和 ZrSn2 金属间化合物。两种复合焊料的 IMC 层均由 Cu6Sn5 和 Cu3Sn 组成。这些层的 SEM 图像用于测量 IMC 层的厚度。Sn58Bi + Mo/Cu 焊点的平均 IMC 层厚度为 1.4431 µm，Sn58Bi + ZrO2/Cu 焊点的平均 IMC 层厚度为 0.9112 µm。焊点的剪切强度通过单次剪切搭接测试法进行了研究。与 Sn58Bi/Cu 焊点相比，Sn58Bi + Mo/Cu 和 Sn58Bi + ZrO2/Cu 焊点的平均最大载荷和剪切应力分别增加了 33% 和 69%。通过比较这两种复合焊点，后者更胜一筹，因为添加较小尺寸的 ZrO2 纳米粒子可以改善界面性能，从而获得更强的焊点。

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来源期刊

Transactions of Nonferrous Metals Society of China 工程技术-冶金工程

CiteScore

7.40

自引率

17.80%

发文量

8456

审稿时长

3.6 months

期刊介绍： The Transactions of Nonferrous Metals Society of China (Trans. Nonferrous Met. Soc. China), founded in 1991 and sponsored by The Nonferrous Metals Society of China, is published monthly now and mainly contains reports of original research which reflect the new progresses in the field of nonferrous metals science and technology, including mineral processing, extraction metallurgy, metallic materials and heat treatments, metal working, physical metallurgy, powder metallurgy, with the emphasis on fundamental science. It is the unique preeminent publication in English for scientists, engineers, under/post-graduates on the field of nonferrous metals industry. This journal is covered by many famous abstract/index systems and databases such as SCI Expanded, Ei Compendex Plus, INSPEC, CA, METADEX, AJ and JICST.