Effect of wire diameter compression ratio on drawing deformation of micro copper wire

IF 4.7 1区 材料科学 Q1 METALLURGY & METALLURGICAL ENGINEERING
Tao HUANG , Han-jiang WU , Ke-xing SONG , Yan-min ZHANG , Yan-jun ZHOU , Shao-lin LI
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引用次数: 0

Abstract

A crystal plasticity finite element model was developed for the drawing deformation of pure copper micro wire, based on rate-dependent crystal plasticity theory. The impact of wire diameter compression ratio on the micro-mechanical deformation behavior during the wire drawing process was investigated. Results indicate that the internal deformation and slip of the drawn wire are unevenly distributed, forming distinct slip and non-slip zones. Additionally, horizontal strain concentration bands develop within the drawn wire. As the wire diameter compression ratio increases, the strength of the slip systems and the extent of slip zones inside the deformation zone also increase. However, the fluctuating stress state, induced by contact pressure and frictional stress, results in a rough and uneven wire surface and diminishes the stability of the drawing process.

线径压缩比对微型铜线拉伸变形的影响
基于速率相关晶体塑性理论,建立了纯铜微线拉伸变形的晶体塑性有限元模型。研究了线径压缩比对拉丝过程中微观机械变形行为的影响。结果表明,拉制线材的内部变形和滑移分布不均,形成了明显的滑移区和非滑移区。此外,拉丝内部还出现了水平应变集中带。随着线径压缩比的增大,滑移系统的强度和变形区内部滑移带的范围也随之增大。然而,由接触压力和摩擦应力引起的波动应力状态会导致线材表面粗糙不平,降低拉拔过程的稳定性。
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来源期刊
CiteScore
7.40
自引率
17.80%
发文量
8456
审稿时长
3.6 months
期刊介绍: The Transactions of Nonferrous Metals Society of China (Trans. Nonferrous Met. Soc. China), founded in 1991 and sponsored by The Nonferrous Metals Society of China, is published monthly now and mainly contains reports of original research which reflect the new progresses in the field of nonferrous metals science and technology, including mineral processing, extraction metallurgy, metallic materials and heat treatments, metal working, physical metallurgy, powder metallurgy, with the emphasis on fundamental science. It is the unique preeminent publication in English for scientists, engineers, under/post-graduates on the field of nonferrous metals industry. This journal is covered by many famous abstract/index systems and databases such as SCI Expanded, Ei Compendex Plus, INSPEC, CA, METADEX, AJ and JICST.
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