Stress measurement and simulation of the key silicon-based structures based on infrared photoelasticity

IF 3.5 2区工程技术 Q2 OPTICS

Optics and Lasers in Engineering Pub Date : 2024-09-19 DOI:10.1016/j.optlaseng.2024.108567

Zikang Xu , Shuiqiang Zhang , Dongsheng Zhang , Lin Chang , Yuqing Zheng , Yongli Wang

引用次数: 0

Abstract

It is important to evaluate the reliability of the key silicon-based structures such as Through silicon vias (TSV) and Micro-electromechanical Systems (MEMS). The thermo-mechanical stress of TSV and the bonding stress of MEMS are quantitatively determined in this paper based on real-time phase shifting using a polarization camera. The polarizated images based on finite element simulation are reconstructed by stress-optic law and Mueller matrix multiplication for experimental verification. A economical infrared polariscope without rotation of optical elements is developed to provide a rapid measurement of stress in silicon-based structures. The error correction algorithm for the low extinction ratio in infrared polariscope is used for measurement of stress. Experimental results indicate that the infrared photoelastic system enables measurement of stress in TSV and MEMS.

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基于红外光弹性的硅基关键结构应力测量与模拟

评估硅通孔（TSV）和微机电系统（MEMS）等关键硅基结构的可靠性非常重要。本文基于偏振相机的实时相移，定量测定了 TSV 的热机械应力和 MEMS 的键合应力。通过应力光学定律和穆勒矩阵乘法重建了基于有限元模拟的偏振图像，并进行了实验验证。开发了一种无需旋转光学元件的经济型红外偏振镜，可快速测量硅基结构中的应力。利用红外偏振镜低消光比的误差修正算法测量应力。实验结果表明，红外光弹性系统能够测量 TSV 和 MEMS 中的应力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Optics and Lasers in Engineering 工程技术-光学

CiteScore

8.90

自引率

8.70%

发文量

384

审稿时长

42 days

期刊介绍： Optics and Lasers in Engineering aims at providing an international forum for the interchange of information on the development of optical techniques and laser technology in engineering. Emphasis is placed on contributions targeted at the practical use of methods and devices, the development and enhancement of solutions and new theoretical concepts for experimental methods. Optics and Lasers in Engineering reflects the main areas in which optical methods are being used and developed for an engineering environment. Manuscripts should offer clear evidence of novelty and significance. Papers focusing on parameter optimization or computational issues are not suitable. Similarly, papers focussed on an application rather than the optical method fall outside the journal''s scope. The scope of the journal is defined to include the following: -Optical Metrology- Optical Methods for 3D visualization and virtual engineering- Optical Techniques for Microsystems- Imaging, Microscopy and Adaptive Optics- Computational Imaging- Laser methods in manufacturing- Integrated optical and photonic sensors- Optics and Photonics in Life Science- Hyperspectral and spectroscopic methods- Infrared and Terahertz techniques