Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Letters Pub Date : 2024-09-12 DOI:10.1016/j.matlet.2024.137394

引用次数: 0

Abstract

The failure mechanism of electromigration (EM) for electronic packaging technology has garnered interest. Electromigration-caused voids reduce electronic device dependability. Two-step reflow at 250℃ and 210℃ was employed to create SAC305/SnPb micro-hybrid solder connections. Finite element analysis confirmed electromigration failure. After 768 h at 10A, the anode interface IMC thickness increased by 149.8 %, while the cathode IMC increased less. Polarity accelerates anode IMC growth. Electromigration of Cu from cathode to anode causes structural flaws and 44.6 % shear strength loss to 35.1 MPa. Fractures shift from inside the solder joint to the IMC layer, becoming brittle. COMSOL simulation demonstrates greatest current density, temperature, and stress at the current inlet and Cu pad-solder joint junction.

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用于封装-封装技术的 SAC305/SnPb 微混合焊点的电迁移失效行为研究：实验与模拟

电子封装技术中的电迁移（EM）失效机制引起了人们的关注。电迁移造成的空洞会降低电子设备的可靠性。在 250℃和 210℃的温度下采用两步回流焊创建 SAC305/SnPb 微混合焊料连接。有限元分析证实了电迁移失效。在 10A 下工作 768 小时后，阳极界面 IMC 厚度增加了 149.8%，而阴极 IMC 的增加幅度较小。极性加速了阳极 IMC 的增长。从阴极到阳极的铜电迁移会导致结构缺陷和 44.6% 的剪切强度损失，使其达到 35.1 兆帕。断裂从焊点内部转移到 IMC 层，变得脆性。COMSOL 仿真显示，在电流入口和铜焊盘-焊点交界处的电流密度、温度和应力最大。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive

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