Direct ink writing of silicone elastomers to fabricate microfluidic devices and soft robots

IF 1.8 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Kento Yamagishi, Rahul Karyappa, Terry Ching, Michinao Hashimoto
{"title":"Direct ink writing of silicone elastomers to fabricate microfluidic devices and soft robots","authors":"Kento Yamagishi, Rahul Karyappa, Terry Ching, Michinao Hashimoto","doi":"10.1557/s43579-024-00631-7","DOIUrl":null,"url":null,"abstract":"<p>This article reviews the recent progress in fabricating microfluidic devices and soft robots using direct ink writing (DIW) three-dimensional (3D) printing with silicone elastomers. Additive manufacturing, especially 3D printing, has become an alternative method to traditional soft lithography for producing microchannels, establishing a new standard in the field of microfluidics. This approach offers unprecedented opportunities for digital control, automation, and the elimination of manual assembly. Among different 3D printing technologies, DIW 3D printing facilitates the accurate deposition of liquid silicone precursors on various substrates in the air or liquid media, enabling the fabrication of microfluidic structures using a one-part room-temperature-vulcanizing (RTV) silicone sealant and two-part addition-curing silicone elastomers. The effectiveness of DIW 3D printing is demonstrated through (1) creating microchannels on various substrates, (2) printing interconnected, multilayer microchannels without the need for sacrificial support materials or extensive post-processing steps, and (3) integrating electronic components into microchannels during the printing process. In this article, overviews of the fabrication of microfluidic devices using 3D printing are provided first, followed by a discussion of different criteria and approaches for DIW 3D printing of silicone-based elastomeric structures in open-air and embedded media. Next, the structure–property relations of silicone-based microfluidic devices are discussed. Then, examples of DIW-fabricated silicone microfluidic devices and soft robotics are showcased, highlighting the unique benefits and opportunities of the methods. Finally, current challenges and future directions in DIW 3D printing of microfluidic systems are discussed.</p><h3 data-test=\"abstract-sub-heading\">Graphical Abstract</h3>\n","PeriodicalId":19016,"journal":{"name":"MRS Communications","volume":"7 1","pages":""},"PeriodicalIF":1.8000,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"MRS Communications","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1557/s43579-024-00631-7","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
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Abstract

This article reviews the recent progress in fabricating microfluidic devices and soft robots using direct ink writing (DIW) three-dimensional (3D) printing with silicone elastomers. Additive manufacturing, especially 3D printing, has become an alternative method to traditional soft lithography for producing microchannels, establishing a new standard in the field of microfluidics. This approach offers unprecedented opportunities for digital control, automation, and the elimination of manual assembly. Among different 3D printing technologies, DIW 3D printing facilitates the accurate deposition of liquid silicone precursors on various substrates in the air or liquid media, enabling the fabrication of microfluidic structures using a one-part room-temperature-vulcanizing (RTV) silicone sealant and two-part addition-curing silicone elastomers. The effectiveness of DIW 3D printing is demonstrated through (1) creating microchannels on various substrates, (2) printing interconnected, multilayer microchannels without the need for sacrificial support materials or extensive post-processing steps, and (3) integrating electronic components into microchannels during the printing process. In this article, overviews of the fabrication of microfluidic devices using 3D printing are provided first, followed by a discussion of different criteria and approaches for DIW 3D printing of silicone-based elastomeric structures in open-air and embedded media. Next, the structure–property relations of silicone-based microfluidic devices are discussed. Then, examples of DIW-fabricated silicone microfluidic devices and soft robotics are showcased, highlighting the unique benefits and opportunities of the methods. Finally, current challenges and future directions in DIW 3D printing of microfluidic systems are discussed.

Graphical Abstract

Abstract Image

利用硅弹性体的直接墨水书写技术制造微流控设备和软机器人
本文回顾了利用硅树脂弹性体直接墨水写入(DIW)三维(3D)打印技术制造微流控装置和软机器人的最新进展。快速成型技术,尤其是三维打印技术,已成为生产微通道的传统软光刻技术的替代方法,在微流体领域确立了新的标准。这种方法为数字控制、自动化和消除手工装配提供了前所未有的机会。在各种三维打印技术中,DIW 三维打印技术有助于在空气或液体介质中将液态硅胶前体准确沉积在各种基底上,从而使用单组分室温硫化(RTV)硅胶密封剂和双组分加成固化硅胶弹性体制造微流控结构。DIW 3D打印的有效性体现在:(1)在各种基底上创建微通道;(2)打印相互连接的多层微通道,而无需牺牲支撑材料或大量后处理步骤;以及(3)在打印过程中将电子元件集成到微通道中。本文首先概述了使用三维打印技术制造微流控设备的情况,然后讨论了在露天和嵌入式介质中对硅基弹性体结构进行 DIW 三维打印的不同标准和方法。接着,讨论了硅基微流体设备的结构-性能关系。然后,展示了 DIW 制造硅基微流体设备和软机器人的实例,突出了这些方法的独特优势和机遇。最后,讨论了 DIW 3D 打印微流控系统目前面临的挑战和未来的发展方向。
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来源期刊
MRS Communications
MRS Communications MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
2.60
自引率
10.50%
发文量
166
审稿时长
>12 weeks
期刊介绍: MRS Communications is a full-color, high-impact journal focused on rapid publication of completed research with broad appeal to the materials community. MRS Communications offers a rapid but rigorous peer-review process and time to publication. Leveraging its access to the far-reaching technical expertise of MRS members and leading materials researchers from around the world, the journal boasts an experienced and highly respected board of principal editors and reviewers.
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