New Electrochemical Approach for Synthesis of Nanoporous Silver

IF 3.1 4区 工程技术 Q2 ELECTROCHEMISTRY
Zhen Lei, Ksenya Mull and Nikolay Dimitrov
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引用次数: 0

Abstract

Cu-Ag alloy films were electrodeposited on Au substrates to serve as precursor alloys for synthesizing finely-structured nanoporous Ag (NPS) structures. Two innovative approaches, surface limited redox replacement (SLRR) and defect mediated growth (DMG) along with overpotential deposition (OPD), were comparatively utilized to fabricate Cu-Ag alloy films. The electrolyte for these novel approaches contained Pb2+ ions to serve either as a sacrificial metal to be replaced by the co-depositing Cu and Ag (in SLRR) or as mediating metal to facilitate the 2D growth of both alloy constituents (in DMG). The resulting alloy films from both approaches displayed superior uniformity and miscibility compared to the OPD alloy, as evidenced by electrochemical scanning electron microscopy (SEM) and X-ray diffraction characterization routines. In a subsequent step, NPS structures were generated through the de-alloying of as-deposited Cu-Ag alloys, as illustrated by SEM imaging that revealed ligament and pore sizes with a thickness in the ballpark of 40 nm. Also, surface area measurements done by a Pb underpotential deposition assay suggested a surface enhancement ratio nearly five times higher than that of flat Ag. Furthermore, various de-alloying potentials were assessed to determine the optimal de-alloying potential for the best outcome of the de-alloying process. Highlights Two new, kinetically mediated approaches were applied to electrodeposit CuAg alloys. Nanoporous Ag (NPS) was synthesized by dealloying of as-deposited CuAg alloys. The optimal dealloying potential range was identified by anodic polarization work. Overpotential growth of CuAg alloy was used as reference throughout the NPS synthesis. The interconnected-porosity NPS structures were studied by SEM and Pb UPD methods.
合成纳米多孔银的新型电化学方法
铜-银合金薄膜被电沉积在金基底上,作为合成精细结构纳米多孔银(NPS)结构的前驱合金。比较利用了表面有限氧化还原置换(SLRR)和缺陷介导生长(DMG)以及过电位沉积(OPD)这两种创新方法来制造铜银合金薄膜。这些新方法的电解质含有 Pb2+ 离子,既可作为牺牲金属被共沉积的铜和银取代(在 SLRR 中),也可作为中介金属促进两种合金成分的二维生长(在 DMG 中)。电化学扫描电子显微镜(SEM)和 X 射线衍射表征程序证明,与 OPD 合金相比,这两种方法生成的合金薄膜具有更高的均匀性和混溶性。在随后的步骤中,通过对沉积的铜银合金进行去合金化处理,生成了 NPS 结构,扫描电子显微镜成像显示了厚度约为 40 纳米的韧带和孔隙大小。此外,通过铅欠电位沉积测定法进行的表面积测量表明,铜银合金的表面增强率比平面铜银合金的表面增强率高出近五倍。此外,还对各种去合金化电位进行了评估,以确定最佳去合金化电位,使去合金化过程达到最佳效果。亮点 将两种新的动力学介导方法应用于电沉积铜银合金。通过对沉积铜银合金进行脱合金,合成了纳米多孔银(NPS)。阳极极化工作确定了最佳脱合金电位范围。在整个 NPS 合成过程中,以铜银合金的过电位生长为参考。通过 SEM 和 Pb UPD 方法研究了相互连接的多孔 NPS 结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
7.20
自引率
12.80%
发文量
1369
审稿时长
1.5 months
期刊介绍: The Journal of The Electrochemical Society (JES) is the leader in the field of solid-state and electrochemical science and technology. This peer-reviewed journal publishes an average of 450 pages of 70 articles each month. Articles are posted online, with a monthly paper edition following electronic publication. The ECS membership benefits package includes access to the electronic edition of this journal.
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