Size dependence on shear fatigue and fracture behavior of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints under current stressing

IF 2.6 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Frontiers in Materials Pub Date : 2024-09-04 DOI:10.3389/fmats.2024.1452773

Bo Wang, Wangyun Li, Kailin Pan, Wei Huang, Yubing Gong

{"title":"Size dependence on shear fatigue and fracture behavior of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints under current stressing","authors":"Bo Wang, Wangyun Li, Kailin Pan, Wei Huang, Yubing Gong","doi":"10.3389/fmats.2024.1452773","DOIUrl":null,"url":null,"abstract":"The shear fatigue performance and fracture behavior of microscale ball grid array (BGA) structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints with different heights (500 μm, 300 μm, and 100 μm) with increasing current density (from 6.0 × 103 to 1.1 × 104 A/cm2) were investigated systematically. The results reveal that the fatigue life of solder joints decreases with increasing current density, while increasing with decreasing the height of solder joints. The location of fatigue fracture shifts from solder matrix to the interface between solder and intermetallic compound (IMC) layer for those with heights of 500 μm and 300 μm with increasing current density, in which the interfacial fracture is triggered by current crowding at the groove of the IMC layer and driven by mismatch strain at the solder/IMC layer interface; while, the fatigue fracture all occurs in the solder matrix for solder joints with a height of 100 μm. Moreover, the fracture in solder matrix of solder joints with heights of 500 μm and 300 μm exhibits an arc-shape fracture path, while a linear path for those with a height of 100 μm. These fracture paths are consistent with the concentration distribution region of plastic strain energy in solder joints.","PeriodicalId":12524,"journal":{"name":"Frontiers in Materials","volume":"10 1","pages":""},"PeriodicalIF":2.6000,"publicationDate":"2024-09-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Frontiers in Materials","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.3389/fmats.2024.1452773","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

引用次数: 0

Abstract

The shear fatigue performance and fracture behavior of microscale ball grid array (BGA) structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints with different heights (500 μm, 300 μm, and 100 μm) with increasing current density (from 6.0 × 103 to 1.1 × 104 A/cm2) were investigated systematically. The results reveal that the fatigue life of solder joints decreases with increasing current density, while increasing with decreasing the height of solder joints. The location of fatigue fracture shifts from solder matrix to the interface between solder and intermetallic compound (IMC) layer for those with heights of 500 μm and 300 μm with increasing current density, in which the interfacial fracture is triggered by current crowding at the groove of the IMC layer and driven by mismatch strain at the solder/IMC layer interface; while, the fatigue fracture all occurs in the solder matrix for solder joints with a height of 100 μm. Moreover, the fracture in solder matrix of solder joints with heights of 500 μm and 300 μm exhibits an arc-shape fracture path, while a linear path for those with a height of 100 μm. These fracture paths are consistent with the concentration distribution region of plastic strain energy in solder joints.

查看原文本刊更多论文

电流应力下球栅阵列结构 Cu/Sn-3.0Ag-0.5Cu/Cu 焊点的剪切疲劳和断裂行为与尺寸有关

系统研究了不同高度（500 μm、300 μm 和 100 μm）的微尺度球栅阵列（BGA）结构 Cu/Sn-3.0Ag-0.5Cu/Cu 焊点在电流密度（从 6.0 × 103 到 1.1 × 104 A/cm2）增加时的剪切疲劳性能和断裂行为。结果表明，焊点的疲劳寿命随着电流密度的增加而降低，但随着焊点高度的降低而增加。随着电流密度的增加，高度为 500 μm 和 300 μm 的焊点的疲劳断裂位置从焊料基体转移到焊料和金属间化合物 (IMC) 层的界面，其中界面断裂是由 IMC 层沟槽处的电流拥挤引发的，并由焊料/IMC 层界面的错配应变驱动；而高度为 100 μm 的焊点的疲劳断裂全部发生在焊料基体中。此外，高度为 500 μm 和 300 μm 的焊点在焊料基体中的断裂路径呈弧形，而高度为 100 μm 的焊点的断裂路径呈线形。这些断裂路径与焊点塑性应变能的集中分布区域一致。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Frontiers in Materials Materials Science-Materials Science (miscellaneous)

CiteScore

4.80

自引率

6.20%

发文量

749

审稿时长

12 weeks

期刊介绍： Frontiers in Materials is a high visibility journal publishing rigorously peer-reviewed research across the entire breadth of materials science and engineering. This interdisciplinary open-access journal is at the forefront of disseminating and communicating scientific knowledge and impactful discoveries to researchers across academia and industry, and the public worldwide. Founded upon a research community driven approach, this Journal provides a balanced and comprehensive offering of Specialty Sections, each of which has a dedicated Editorial Board of leading experts in the respective field.