Study on carbon allotrope abrasive particles based on C60 molecule for diamond chemical mechanical polishing

IF 1.5 4区物理与天体物理 Q3 PHYSICS, APPLIED

Japanese Journal of Applied Physics Pub Date : 2024-08-13 DOI:10.35848/1347-4065/ad59e9

Junpei Takeiri, Keisuke Suzuki, Hiroaki Iura, Taisuke Hantani, Masaki Morii, Hideaki Nisizawa

引用次数: 0

Abstract

In this study, we developed C₆₀ reactive diamond composite particles for the chemical mechanical polishing (CMP) of diamond substrates by applying the high hardness and high reactivity of the C₆₀ molecule. When diamond substrates were polished using these C₆₀ diamond composite particles, the polished surface was found to be superior to that of diamond particles. In addition, when the composite particles were irradiated with ultraviolet light to produce polishing fine particles, the polishing rate was improved by about 30%. These results indicate that the composite nanoparticles that reacted with C₆₀ have the potential to remove even the hardest of diamond substrates.

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基于 C60 分子的碳同位素磨料颗粒在金刚石化学机械抛光中的应用研究

在这项研究中，我们利用 C60 分子的高硬度和高反应活性，开发了用于金刚石基底化学机械抛光（CMP）的 C60 反应金刚石复合颗粒。当使用这些 C60 金刚石复合颗粒抛光金刚石基底时，发现抛光表面优于金刚石颗粒。此外，当用紫外线照射复合颗粒以产生抛光细颗粒时，抛光率提高了约 30%。这些结果表明，与 C60 反应的复合纳米粒子具有去除最坚硬的金刚石基底的潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Japanese Journal of Applied Physics 物理-物理：应用

CiteScore

3.00

自引率

26.70%

发文量

818

审稿时长

3.5 months

期刊介绍： The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP). JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields: • Semiconductors, dielectrics, and organic materials • Photonics, quantum electronics, optics, and spectroscopy • Spintronics, superconductivity, and strongly correlated materials • Device physics including quantum information processing • Physics-based circuits and systems • Nanoscale science and technology • Crystal growth, surfaces, interfaces, thin films, and bulk materials • Plasmas, applied atomic and molecular physics, and applied nuclear physics • Device processing, fabrication and measurement technologies, and instrumentation • Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS