Spin‐coating fabrication of high‐yield and uniform organic thin‐film transistors via a primer template growth

Aggregate Pub Date : 2024-09-04 DOI:10.1002/agt2.661
Zhenxin Yang, Jiale Su, Junzhan Wang, Xuanhe Li, Fushun Li, Juntao Hu, Nan Chen, Zhang Tao, Delong Yang, Deng‐Ke Wang, Qiang Zhu, Yuhui Liao, Zheng‐Hong Lu
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Abstract

Solution coating of organic semiconductors offers great potential for achieving low‐cost and high‐throughput manufacturing of large‐area and flexible electronics. However, the solution processability of semiconducting small molecules for fabricating uniform and reliable thin‐film devices poses challenges due to the low viscosities of small‐molecule solutions. Here, we report a universal approach employing a primer template (PT) to enhance the spreadability of small‐molecule solutions on silicon wafers, enabling the spin‐coating fabrication of uniform thin films composed of millimeter‐scale grains with complete large‐area coverage and well‐ordered molecular packing. Using PT, we fabricated organic thin‐film transistors (OTFTs) using solutions containing various small molecules such as rubrene and 2‐decyl‐7‐phenyl‐[1]benzothieno[3,2‐b][1]benzothiophene. The device yield of all fabricated OTFTs is consistently 100% while achieving a high average mobility of 1.62 cm2 V−1 s−1 with a device‐to‐device variation of 7.7% measured in ambient air condition. In addition, the utilization of PT resulted in a batch‐to‐batch variation of 12.5% in device performance over dozens of OTFT devices. The key industrial manufacturing metrics, such as device yield, reproducibility, and performance uniformity of the PT OTFTs, are among the best for devices fabricated using solution spin‐coating techniques.

Abstract Image

通过引物模板生长法旋涂制造高产、均匀的有机薄膜晶体管
有机半导体的溶液涂层为实现大面积柔性电子器件的低成本、高产量制造提供了巨大潜力。然而,由于小分子溶液的粘度较低,在制造均匀可靠的薄膜器件时,半导体小分子溶液的可加工性带来了挑战。在此,我们报告了一种通用方法,该方法采用引物模板(PT)来提高小分子溶液在硅晶片上的可铺展性,从而能够通过旋涂制造由毫米级晶粒组成的均匀薄膜,这些晶粒具有完整的大面积覆盖和有序的分子堆积。利用 PT,我们使用含有各种小分子(如红芘和 2-癸基-7-苯基-[1]苯并噻吩并[3,2-b][1]苯并噻吩)的溶液制造了有机薄膜晶体管(OTFT)。所有制备的 OTFT 器件良率始终保持在 100%,同时实现了 1.62 cm2 V-1 s-1 的高平均迁移率,在环境空气条件下,器件与器件之间的差异为 7.7%。此外,利用 PT 技术,在数十个 OTFT 器件中,批次与批次之间的器件性能差异仅为 12.5%。PT OTFT 的器件良率、可重复性和性能一致性等关键工业制造指标,在使用溶液旋涂技术制造的器件中名列前茅。
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