The role of Sb on the microstructure and creep behaviors of Sn–6.5Zn–0.3Cu Pb-free solder alloy

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2024-09-11 DOI:10.1007/s10854-024-13421-7

M. Ragab, Hind Alsnani, A. E. Hammad, Ashraf S. Abd‑Elrahman

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Abstract

The objective of this research is to investigate the role of Sb addition on the microstructure and creep behaviors of the Sn–6.5Zn–0.3Cu solder alloy. Concerning microstructure examinations, the results exhibited that the Sb addition to the Sn–6.5Zn–0.3Cu alloy successfully produced uniform dispersion of γ-Cu₅Zn₈ and Sb₂SnZn intermetallic compounds (IMCs) along with α-Zn and β-Sn matrix, resulting in the microstructure refinement. In addition, because Cu–Zn and Sb–Sn–Zn IMC particles formed, the adverse effects of the oxidation resistance of Zn were reduced. The results showed that the microstructure and creep behaviors of the Sn–6.5Zn–0.3Cu-based alloy improved with Sb addition. Specifically, the creep resistance of the Sn–6.5Zn–0.3Cu alloy was greatly improved by the addition of 3.0 Sb and 1.0 Sb, resulting in enhancements of around 460% and 170%, respectively, due to the solid solution and finely dispersed IMCs. Due to the solid solution’s strengthening and the various dispersed IMCs, the Sb-containing solder alloys also displayed prolonged creep lifetimes and the highest stress exponents. In view of results, the microalloying of Sb in Sn–6.5Zn–0.3Cu-based alloy has produced dependable, high-performance creep properties that satisfy the needs of the industrial applications.

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锑对锡-6.5锌-0.3铜无铅焊料合金微观结构和蠕变行为的影响

本研究旨在探讨添加锑对锡-6.5Zn-0.3Cu 焊料合金的微观结构和蠕变行为的影响。在微观结构检测方面，结果表明在锡-6.5Zn-0.3Cu 合金中添加 Sb 成功地产生了均匀分散的 γ-Cu5Zn8 和 Sb2SnZn 金属间化合物 (IMC)，以及 α-Zn 和 β-Sn 基体，从而导致了微观结构的细化。此外，由于形成了 Cu-Zn 和 Sb-Sn-Zn IMC 颗粒，减少了 Zn 抗氧化性的不利影响。结果表明，添加 Sb 后，锡-6.5Zn-0.3Cu 基合金的微观结构和蠕变性能都得到了改善。具体来说，由于固溶体和细微分散的 IMC 的作用，添加 3.0 Sb 和 1.0 Sb 后，锡-6.5Zn-0.3Cu 合金的抗蠕变性大大提高，分别提高了约 460% 和 170%。由于固溶体的强化作用和各种分散的 IMC，含锑焊料合金还显示出较长的蠕变寿命和最高的应力指数。从上述结果来看，在锡-6.5锌-0.3铜基合金中进行锑微合金化已产生了可靠、高性能的蠕变特性，满足了工业应用的需要。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.