{"title":"Effects of nano-SiO2 on microstructure and magnetic properties of FeSi soft magnetic composites","authors":"Yu Peng","doi":"10.1007/s10854-024-13437-z","DOIUrl":null,"url":null,"abstract":"<p>FeSi soft magnetic composites (SMCs) were fabricated using nano-SiO<sub>2</sub>/epoxy silicone resin (ESR) as insulating layers, and the influence of SiO<sub>2</sub> content on microstructure and magnetic properties of soft magnetic composites were investigated. The introduction of suitable nano-SiO<sub>2</sub> into epoxy silicone resin increase the density, permeability and resistivity which then reduce of magnetic loss of SMCs. SiO<sub>2</sub> nanoparticles distribute in the ESR and coat on the magnetic metal particle surface, and the formation of insulating coating caused by the addition of SiO<sub>2</sub> nano-particles reduce the magnetic loss and which can be attributed to the reduction of eddy-current loss. Excess SiO<sub>2</sub> addition result in the aggregation of SiO<sub>2</sub> particle between magnetic particles, which then destroy magnetic performance. The SMCs with 0.50 wt% SiO<sub>2</sub> has the optimized performance with high effective permeability (94) and reduced magnetic loss (152.03 mW/cm<sup>3</sup>, at 100 kHz and 40 mT). And the influence of introduce of SiO<sub>2</sub> particles on the microstructure and magnetic properties was discussed.</p>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":null,"pages":null},"PeriodicalIF":2.8000,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s10854-024-13437-z","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
FeSi soft magnetic composites (SMCs) were fabricated using nano-SiO2/epoxy silicone resin (ESR) as insulating layers, and the influence of SiO2 content on microstructure and magnetic properties of soft magnetic composites were investigated. The introduction of suitable nano-SiO2 into epoxy silicone resin increase the density, permeability and resistivity which then reduce of magnetic loss of SMCs. SiO2 nanoparticles distribute in the ESR and coat on the magnetic metal particle surface, and the formation of insulating coating caused by the addition of SiO2 nano-particles reduce the magnetic loss and which can be attributed to the reduction of eddy-current loss. Excess SiO2 addition result in the aggregation of SiO2 particle between magnetic particles, which then destroy magnetic performance. The SMCs with 0.50 wt% SiO2 has the optimized performance with high effective permeability (94) and reduced magnetic loss (152.03 mW/cm3, at 100 kHz and 40 mT). And the influence of introduce of SiO2 particles on the microstructure and magnetic properties was discussed.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.