Heat‐resistant and transparent polyimides derived from alicyclic dianhydrides and phthalazinone‐based diamine

IF 3.1 4区 工程技术 Q2 POLYMER SCIENCE
Bingbing Wang, Lishuai Zong, Jinyan Wang, Yabin Zhang, Wenhua Hou, Xigao Jian
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引用次数: 0

Abstract

Advanced flexible display materials have drastically sparked considerable interest for heat‐resistant, low dielectric, and transparent polyimide (PI) materials. In light of this, our study aims to develop high‐performance semi‐aromatic PI films, followed by investigate the correlations between bridged‐alkyl/heteroaromatic ring structures and their thermal, dielectric, optical, and mechanical properties. Such PI films, namely AP‐PIs, were synthesized with a one‐step high‐temperature method between 4‐[4‐(4‐aminophenoxy) phenyl]‐2‐(4‐aminophenyl)‐1(2H)‐phthalazinone (DHPZDA) and various commercial alicyclic dianhydrides. The incorporation of rigid phthalazinone structures significantly enhanced thermal resistance and mechanical flexibility, while simultaneously reducing their dielectric constant (Dk), attributed to the large polymer internal free volume. Impressively, the prepared films exhibit exceptional glass transition temperature (Tg) as high as 419°C (DMTA tanδ peak), low Dk as low as 2.71, and elongation at break (ε %) up to 50.4%. Furthermore, AP‐PI films demonstrate reasonable solubility and optical transparency within the UV–visible region. The maximum optical transmittance at 550 nm (T550 nm) could reach 83.01%. These desirable properties position these materials as promising candidates for flexible substrate applications.
脂环族二酐和酞嗪酮基二胺衍生的耐热透明聚酰亚胺
先进的柔性显示材料引发了人们对耐热、低介电和透明聚酰亚胺(PI)材料的极大兴趣。有鉴于此,我们的研究旨在开发高性能的半芳香族聚酰亚胺薄膜,并研究桥接烷基/异芳香族环结构与其热、介电、光学和机械性能之间的相关性。4-[4-(4-aminophenoxy) phenyl]-2-(4-aminophenyl)-1(2H)-phthalazinone (DHPZDA) 与各种商用脂环族二酐通过一步高温法合成了这种 PI 薄膜,即 AP-PI。刚性酞嗪酮结构的加入显著增强了薄膜的耐热性和机械柔韧性,同时降低了其介电常数(Dk),这归因于聚合物内部自由体积较大。令人印象深刻的是,所制备薄膜的玻璃化转变温度(Tg)高达 419°C(DMTA tanδ 峰值),Dk 低至 2.71,断裂伸长率(ε %)高达 50.4%。此外,AP-PI 薄膜在紫外可见光区域内表现出合理的溶解性和光学透明度。550 纳米(T550 纳米)处的最大透光率可达 83.01%。这些理想特性使这些材料成为柔性基底应用的理想候选材料。
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来源期刊
Polymers for Advanced Technologies
Polymers for Advanced Technologies 工程技术-高分子科学
CiteScore
6.20
自引率
5.90%
发文量
337
审稿时长
2.1 months
期刊介绍: Polymers for Advanced Technologies is published in response to recent significant changes in the patterns of materials research and development. Worldwide attention has been focused on the critical importance of materials in the creation of new devices and systems. It is now recognized that materials are often the limiting factor in bringing a new technical concept to fruition and that polymers are often the materials of choice in these demanding applications. A significant portion of the polymer research ongoing in the world is directly or indirectly related to the solution of complex, interdisciplinary problems whose successful resolution is necessary for achievement of broad system objectives. Polymers for Advanced Technologies is focused to the interest of scientists and engineers from academia and industry who are participating in these new areas of polymer research and development. It is the intent of this journal to impact the polymer related advanced technologies to meet the challenge of the twenty-first century. Polymers for Advanced Technologies aims at encouraging innovation, invention, imagination and creativity by providing a broad interdisciplinary platform for the presentation of new research and development concepts, theories and results which reflect the changing image and pace of modern polymer science and technology. Polymers for Advanced Technologies aims at becoming the central organ of the new multi-disciplinary polymer oriented materials science of the highest scientific standards. It will publish original research papers on finished studies; communications limited to five typewritten pages plus three illustrations, containing experimental details; review articles of up to 40 pages; letters to the editor and book reviews. Review articles will normally be published by invitation. The Editor-in-Chief welcomes suggestions for reviews.
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