{"title":"Heat‐resistant and transparent polyimides derived from alicyclic dianhydrides and phthalazinone‐based diamine","authors":"Bingbing Wang, Lishuai Zong, Jinyan Wang, Yabin Zhang, Wenhua Hou, Xigao Jian","doi":"10.1002/pat.6562","DOIUrl":null,"url":null,"abstract":"Advanced flexible display materials have drastically sparked considerable interest for heat‐resistant, low dielectric, and transparent polyimide (PI) materials. In light of this, our study aims to develop high‐performance semi‐aromatic PI films, followed by investigate the correlations between bridged‐alkyl/heteroaromatic ring structures and their thermal, dielectric, optical, and mechanical properties. Such PI films, namely AP‐PIs, were synthesized with a one‐step high‐temperature method between 4‐[4‐(4‐aminophenoxy) phenyl]‐2‐(4‐aminophenyl)‐1(2H)‐phthalazinone (DHPZDA) and various commercial alicyclic dianhydrides. The incorporation of rigid phthalazinone structures significantly enhanced thermal resistance and mechanical flexibility, while simultaneously reducing their dielectric constant (<jats:italic>D</jats:italic><jats:sub>k</jats:sub>), attributed to the large polymer internal free volume. Impressively, the prepared films exhibit exceptional glass transition temperature (<jats:italic>T</jats:italic><jats:sub>g</jats:sub>) as high as 419°C (DMTA tanδ peak), low <jats:italic>D</jats:italic><jats:sub>k</jats:sub> as low as 2.71, and elongation at break (<jats:italic>ε</jats:italic> %) up to 50.4%. Furthermore, AP‐PI films demonstrate reasonable solubility and optical transparency within the UV–visible region. The maximum optical transmittance at 550 nm (T<jats:sub>550 nm</jats:sub>) could reach 83.01%. These desirable properties position these materials as promising candidates for flexible substrate applications.","PeriodicalId":20382,"journal":{"name":"Polymers for Advanced Technologies","volume":"32 1","pages":""},"PeriodicalIF":3.1000,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymers for Advanced Technologies","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1002/pat.6562","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0
Abstract
Advanced flexible display materials have drastically sparked considerable interest for heat‐resistant, low dielectric, and transparent polyimide (PI) materials. In light of this, our study aims to develop high‐performance semi‐aromatic PI films, followed by investigate the correlations between bridged‐alkyl/heteroaromatic ring structures and their thermal, dielectric, optical, and mechanical properties. Such PI films, namely AP‐PIs, were synthesized with a one‐step high‐temperature method between 4‐[4‐(4‐aminophenoxy) phenyl]‐2‐(4‐aminophenyl)‐1(2H)‐phthalazinone (DHPZDA) and various commercial alicyclic dianhydrides. The incorporation of rigid phthalazinone structures significantly enhanced thermal resistance and mechanical flexibility, while simultaneously reducing their dielectric constant (Dk), attributed to the large polymer internal free volume. Impressively, the prepared films exhibit exceptional glass transition temperature (Tg) as high as 419°C (DMTA tanδ peak), low Dk as low as 2.71, and elongation at break (ε %) up to 50.4%. Furthermore, AP‐PI films demonstrate reasonable solubility and optical transparency within the UV–visible region. The maximum optical transmittance at 550 nm (T550 nm) could reach 83.01%. These desirable properties position these materials as promising candidates for flexible substrate applications.
期刊介绍:
Polymers for Advanced Technologies is published in response to recent significant changes in the patterns of materials research and development. Worldwide attention has been focused on the critical importance of materials in the creation of new devices and systems. It is now recognized that materials are often the limiting factor in bringing a new technical concept to fruition and that polymers are often the materials of choice in these demanding applications. A significant portion of the polymer research ongoing in the world is directly or indirectly related to the solution of complex, interdisciplinary problems whose successful resolution is necessary for achievement of broad system objectives.
Polymers for Advanced Technologies is focused to the interest of scientists and engineers from academia and industry who are participating in these new areas of polymer research and development. It is the intent of this journal to impact the polymer related advanced technologies to meet the challenge of the twenty-first century.
Polymers for Advanced Technologies aims at encouraging innovation, invention, imagination and creativity by providing a broad interdisciplinary platform for the presentation of new research and development concepts, theories and results which reflect the changing image and pace of modern polymer science and technology.
Polymers for Advanced Technologies aims at becoming the central organ of the new multi-disciplinary polymer oriented materials science of the highest scientific standards. It will publish original research papers on finished studies; communications limited to five typewritten pages plus three illustrations, containing experimental details; review articles of up to 40 pages; letters to the editor and book reviews. Review articles will normally be published by invitation. The Editor-in-Chief welcomes suggestions for reviews.