{"title":"Chapter 15: Quality Control of Assembly and Mounting","authors":"V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov","doi":"10.3103/S1068375524700157","DOIUrl":null,"url":null,"abstract":"<p>This chapter delineates detailed methods and tools for the visual inspection of soldered joints. It enumerates the primary types of defects and the capabilities of automatic visual and electrical inspection for their detection and highlights the use of automatic equipment for thermographic, acoustic, and X-ray inspection of soldered and microsoldered joints. The methodology for monitoring transient electrical resistance in contact connections is also examined. For automatic electrical inspection of connections, systems equipped with flying probes are used. These systems supply power and receive signals from the inspected connection on the board or component, automatically verifying functionality. The criteria for assessing the strength of soldered joints include the magnitude of the pull-off force, the durability of the joints under alternating loads, and vibration resistance. Destructive testing is employed to ascertain the mechanical and physico-mechanical properties of soldered joints. In metallographic inspection, the diffusion zone between the solder and the base metal is identified, and the quality of the soldered joint is assessed based on its width. Typical defects of soldered joints and their causes are considered.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":"60 3","pages":"572 - 598"},"PeriodicalIF":0.9000,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Surface Engineering and Applied Electrochemistry","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.3103/S1068375524700157","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0
Abstract
This chapter delineates detailed methods and tools for the visual inspection of soldered joints. It enumerates the primary types of defects and the capabilities of automatic visual and electrical inspection for their detection and highlights the use of automatic equipment for thermographic, acoustic, and X-ray inspection of soldered and microsoldered joints. The methodology for monitoring transient electrical resistance in contact connections is also examined. For automatic electrical inspection of connections, systems equipped with flying probes are used. These systems supply power and receive signals from the inspected connection on the board or component, automatically verifying functionality. The criteria for assessing the strength of soldered joints include the magnitude of the pull-off force, the durability of the joints under alternating loads, and vibration resistance. Destructive testing is employed to ascertain the mechanical and physico-mechanical properties of soldered joints. In metallographic inspection, the diffusion zone between the solder and the base metal is identified, and the quality of the soldered joint is assessed based on its width. Typical defects of soldered joints and their causes are considered.
摘要 本章详细介绍了对焊接接头进行视觉检测的方法和工具。它列举了主要的缺陷类型以及自动视觉和电气检查对其进行检测的能力,并重点介绍了使用自动设备对焊接和微焊接接头进行热成像、声学和 X 射线检查的情况。此外,还研究了监测接触连接中瞬态电阻的方法。对于连接的自动电气检测,使用的是配备飞针的系统。这些系统为电路板或元件上的受检连接供电并接收信号,自动验证功能。评估焊接接头强度的标准包括拉拔力的大小、接头在交变负载下的耐久性和抗振性。破坏性测试用于确定焊接接头的机械和物理机械性能。在金相检测中,要确定焊料和基底金属之间的扩散区,并根据扩散区的宽度评估焊点的质量。还考虑了焊点的典型缺陷及其原因。
期刊介绍:
Surface Engineering and Applied Electrochemistry is a journal that publishes original and review articles on theory and applications of electroerosion and electrochemical methods for the treatment of materials; physical and chemical methods for the preparation of macro-, micro-, and nanomaterials and their properties; electrical processes in engineering, chemistry, and methods for the processing of biological products and food; and application electromagnetic fields in biological systems.