{"title":"Influence of Zr addition on the microstructure, mechanical and electrical properties of Mo-Cu alloy","authors":"He Zhang, Guo-Hua Zhang","doi":"10.1016/j.mtcomm.2024.110307","DOIUrl":null,"url":null,"abstract":"In order to strengthen the overall properties of Mo-Cu alloy, Zr was added to Mo-Cu alloy to enhance the bond strength of Mo/Cu interface and form solid solution strengthening effect. The excellent properties of Mo-Cu-Zr blocks were attained through infiltrating Cu-Zr blocks containing various Zr contents into the Mo skeleton. Compared to the incoherent interface of Mo/Cu in Mo-Cu block, the addition of Zr changed its interface to the coherent interface of Mo-Zr/Cu-Zr. All Mo-Cu-Zr alloy blocks possessed high densification degrees (97.1 %∼98.4 %) to assure the excellent general properties. Besides, the formations of Mo-Zr and Cu-Zr solid solutions assured the block owned excellent mechanical strength. Especially, the addition of Zr purified the grain boundary through absorbing oxygen to produce ZrO which prevented the Mo-Zr grain growth. As increasing Zr amount from 0 to 4.73 wt%, the Mo-Zr (or Mo) grain size reduced from 5 to 4.0 μm. Mo-Cu sintered sample containing 2.40 wt% Zr possessed the highest tension strength of 494 MPa. Besides, since the finer grain size of Mo-Zr alloy, this block also owned the highest micro-hardness (250 HV) and bending strength (1626 MPa), respectively. But, the generations of Cu-Zr solid-solution and ZrO also damaged the electrical conductivities to a certain extent. Specifically, as the addition amount of zirconium increased from 0 to 2.40 wt%, the conductivity decreased from 42.67 % to 32.15 %IACS.","PeriodicalId":18477,"journal":{"name":"Materials Today Communications","volume":"23 1","pages":""},"PeriodicalIF":3.7000,"publicationDate":"2024-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Today Communications","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1016/j.mtcomm.2024.110307","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
In order to strengthen the overall properties of Mo-Cu alloy, Zr was added to Mo-Cu alloy to enhance the bond strength of Mo/Cu interface and form solid solution strengthening effect. The excellent properties of Mo-Cu-Zr blocks were attained through infiltrating Cu-Zr blocks containing various Zr contents into the Mo skeleton. Compared to the incoherent interface of Mo/Cu in Mo-Cu block, the addition of Zr changed its interface to the coherent interface of Mo-Zr/Cu-Zr. All Mo-Cu-Zr alloy blocks possessed high densification degrees (97.1 %∼98.4 %) to assure the excellent general properties. Besides, the formations of Mo-Zr and Cu-Zr solid solutions assured the block owned excellent mechanical strength. Especially, the addition of Zr purified the grain boundary through absorbing oxygen to produce ZrO which prevented the Mo-Zr grain growth. As increasing Zr amount from 0 to 4.73 wt%, the Mo-Zr (or Mo) grain size reduced from 5 to 4.0 μm. Mo-Cu sintered sample containing 2.40 wt% Zr possessed the highest tension strength of 494 MPa. Besides, since the finer grain size of Mo-Zr alloy, this block also owned the highest micro-hardness (250 HV) and bending strength (1626 MPa), respectively. But, the generations of Cu-Zr solid-solution and ZrO also damaged the electrical conductivities to a certain extent. Specifically, as the addition amount of zirconium increased from 0 to 2.40 wt%, the conductivity decreased from 42.67 % to 32.15 %IACS.
期刊介绍:
Materials Today Communications is a primary research journal covering all areas of materials science. The journal offers the materials community an innovative, efficient and flexible route for the publication of original research which has not found the right home on first submission.