Investigation of dynamic characteristics and fatigue life prediction of Pb free solder material under random vibration

IF 1.8 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Saravanakumar K, S Saravanan, N Muthuram
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引用次数: 0

Abstract

Electronic packages are employed in diverse industries, including automotive, aerospace, and defense. However, their susceptibility to failure arises from exposure to uncontrolled operating conditions, particularly vibrations.Therefore, an investigation has been conducted to explore the effect of vibration in fatigue life of SAC305 lead free solder material employed in Printed Circuit Board (PCB) assembly with ball grid array (BGA) 144 electronic package. Finite Element Analysis (FEA) of a printed circuit board with BGA 144 electronic package was conducted to find their dynamic characterisics like natural frequencies and their mode shapes. Experiments were conducted to validate the numerically developed model, where first, second and third modes shapes from FEA and experimental results were compared. In addition, random vibration analysis was performed using numerical simulation where individual solder balls were analysed for stress distribution and experimentswere conducted on specially fabricated PCBs using electro dynamic shaker for validation. Analysis shows that the failure was prominent at the solder balls located at the corner of the package. Further, Minor’s rule was used to estimate the fatigue life of the Pb free solder material in BGA 144 package.
无铅焊接材料在随机振动下的动态特性和疲劳寿命预测研究
电子封装广泛应用于汽车、航空航天和国防等行业。因此,我们进行了一项调查,以探索振动对带有球栅阵列(BGA)144 电子封装的印刷电路板(PCB)装配中使用的 SAC305 无铅焊接材料疲劳寿命的影响。对带有 BGA 144 电子封装的印刷电路板进行了有限元分析(FEA),以找出其动态特性,如固有频率和模态振型。为验证数值模型,还进行了实验,比较了有限元分析和实验结果得出的第一、第二和第三模态振型。此外,还使用数值模拟进行了随机振动分析,分析了单个焊球的应力分布,并使用电动振动器在专门制作的印刷电路板上进行了实验验证。分析表明,故障主要发生在位于封装角落的焊球上。此外,还使用 Minor 规则估算了 BGA 144 封装中无铅焊接材料的疲劳寿命。
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来源期刊
Materials Research Express
Materials Research Express MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
4.50
自引率
4.30%
发文量
640
审稿时长
12 weeks
期刊介绍: A broad, rapid peer-review journal publishing new experimental and theoretical research on the design, fabrication, properties and applications of all classes of materials.
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