Joint Interface Microstructure Analysis of Gallium-based Thermal Interface Material During Reflow

IF 2.2 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Electronic Materials Pub Date : 2024-08-17 DOI:10.1007/s11664-024-11360-x

Bo-Yi Lin, Ting-Chun Lin, Chin-Li Kao, Shih-Chieh Hsiao, Pei-Hsuan Tseng, Jui-Chao Kuo

引用次数: 0

Abstract

Thermal interface materials (TIMs), which are recently being used in high-power and new-generation materials, improve thermal stability at high temperatures because of the formation of intermetallic compounds. In this study, Cu-type Ga-based TIM solder has been selected to investigate the interface reaction of Ga-based thermal interface materials after curing, annealing, and reflow. During the curing process, liquid Ga diffuses through the X-alloy and reacts with Cu, resulting in the formation of the CuGa₂ phase. With the increase of annealing time, the area fraction of CuGa₂ and Cu₉Ga₄ decreases by 38% and increases by 44% because of the further diffusion of Cu into Ga, respectively. During reflow, the diffusion of Cu atoms into Ga leads to the formation of the solid solution of Cu and Ga. Meanwhile, the melted X-alloy reacts with Cu and forms Cu₆X₅.

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镓基热敏界面材料在回流过程中的接合界面微观结构分析

热界面材料（TIMs）最近被应用于大功率和新一代材料中，由于形成了金属间化合物，因而提高了高温下的热稳定性。本研究选择了 Cu 型 Ga 基 TIM 焊料来研究 Ga 基热敏界面材料在固化、退火和回流焊后的界面反应。在固化过程中，液态 Ga 通过 X 合金扩散并与 Cu 反应，形成 CuGa2 相。随着退火时间的增加，CuGa2 和 Cu9Ga4 的面积分数分别减少了 38% 和增加了 44%，这是因为铜进一步扩散到了 Ga 中。在回流过程中，Cu 原子向 Ga 的扩散导致形成 Cu 和 Ga 的固溶体。同时，熔化的 X 合金与铜发生反应，形成 Cu6X5。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Electronic Materials 工程技术-材料科学：综合

CiteScore

4.10

自引率

4.80%

发文量

693

审稿时长

3.8 months

期刊介绍： The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications. Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field. A journal of The Minerals, Metals & Materials Society.