Unsupervised and Semisupervised Machine Learning Frameworks for Multiclass Tool Wear Recognition

IF 5.2 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Maryam Assafo;Peter Langendoerfer
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引用次数: 0

Abstract

Tool condition monitoring (TCM) is crucial to ensure good quality products and avoid downtime. Machine learning has proven to be vital for TCM. However, existing works are predominately based on supervised learning, which hinders their applicability in real-world manufacturing settings, where data labeling is cumbersome and costly with in-service machines. Additionally, the existing unsupervised solutions mostly handle binary decision-based TCM which is unable to fully reflect the dynamics of tool wear progression. To address these issues, we propose different unsupervised and semisupervised five-class tool wear recognition frameworks to handle fully unlabeled and partially labeled data, respectively. The underlying methods include Laplacian score, sparse autoencoder (SAE), stacked SAE (SSAE), self-organizing map, Softmax, support vector machine, and random forest. For the semisupervised frameworks, we considered designs where labeled data influence only feature learning, classifier building, or both. We also investigated different training configurations of SSAE regarding the supervision level. We applied the frameworks on two run-to-failure datasets of milling tools, recorded using a microphone and an accelerometer. Single sensor and multisensor data under different percentages of labeled training data were considered in the evaluation. The results showed which of the frameworks led to the best predictive performance under which data settings, and highlighted the significance of sensor fusion and discriminative feature representations in combating the unavailability and scarcity of labels, among other findings. The highest macro-F1 achieved for the two datasets with fully unlabeled data reached 87.52% and 75.80%, respectively, and over 90% when only 25% of the training observations were labeled.
用于多类别刀具磨损识别的无监督和半监督机器学习框架
刀具状态监测 (TCM) 对于确保产品质量和避免停机至关重要。事实证明,机器学习对工具状态监测至关重要。然而,现有的工作主要基于监督学习,这阻碍了它们在实际制造环境中的适用性,因为在实际制造环境中,使用在役机器进行数据标注既麻烦又昂贵。此外,现有的无监督解决方案主要处理基于二元决策的工具磨损,无法完全反映工具磨损的动态发展。为了解决这些问题,我们提出了不同的无监督和半监督五级刀具磨损识别框架,以分别处理完全无标记和部分标记的数据。基础方法包括拉普拉卡得分、稀疏自动编码器(SAE)、堆叠自动编码器(SSAE)、自组织图、Softmax、支持向量机和随机森林。在半监督框架中,我们考虑了标注数据只影响特征学习、分类器构建或两者兼而有之的设计。我们还研究了 SSAE 在监督级别方面的不同训练配置。我们在使用麦克风和加速度计记录的两个铣削工具运行到故障数据集上应用了这些框架。在评估中,我们考虑了单传感器数据和多传感器数据,并使用了不同比例的标注训练数据。结果表明,在何种数据设置下,哪种框架的预测性能最好,并强调了传感器融合和判别特征表示在解决标签不可用和稀缺等问题上的重要性。在两个完全未标注数据的数据集上实现的最高宏F1分别达到了87.52%和75.80%,而当只有25%的训练观测数据被标注时,宏F1则超过了90%。
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来源期刊
IEEE Open Journal of the Industrial Electronics Society
IEEE Open Journal of the Industrial Electronics Society ENGINEERING, ELECTRICAL & ELECTRONIC-
CiteScore
10.80
自引率
2.40%
发文量
33
审稿时长
12 weeks
期刊介绍: The IEEE Open Journal of the Industrial Electronics Society is dedicated to advancing information-intensive, knowledge-based automation, and digitalization, aiming to enhance various industrial and infrastructural ecosystems including energy, mobility, health, and home/building infrastructure. Encompassing a range of techniques leveraging data and information acquisition, analysis, manipulation, and distribution, the journal strives to achieve greater flexibility, efficiency, effectiveness, reliability, and security within digitalized and networked environments. Our scope provides a platform for discourse and dissemination of the latest developments in numerous research and innovation areas. These include electrical components and systems, smart grids, industrial cyber-physical systems, motion control, robotics and mechatronics, sensors and actuators, factory and building communication and automation, industrial digitalization, flexible and reconfigurable manufacturing, assistant systems, industrial applications of artificial intelligence and data science, as well as the implementation of machine learning, artificial neural networks, and fuzzy logic. Additionally, we explore human factors in digitalized and networked ecosystems. Join us in exploring and shaping the future of industrial electronics and digitalization.
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