{"title":"A 28-nm 9T SRAM-based CIM macro with capacitance weighting module and redundant array-assisted ADC","authors":"Zhiting Lin , Runru Yu , Da Huo, Qingchuan Zhu, Miao Long, Yongqi Qin, Yanchun Liu, Lintao Chen, Simin Wang, Ting Wang, Yousheng Xing, Zeshi Wen, Yu Liu, Xin Li, Chenghu Dai, Qiang Zhao, Chunyu Peng, Xiulong Wu","doi":"10.1016/j.mejo.2024.106397","DOIUrl":null,"url":null,"abstract":"<div><p>In the emerging field of Computing-in-Memory (CIM), this study introduces a 28-nm CMOS-based Static Random Access Memory (SRAM) CIM macro capable of various computational modes, potentially offering a solution to the Von Neumann bottleneck. Beyond traditional SRAM read and write operations, to enhance the flexibility of the CIM macro, a 9T cell is proposed for performing AND, OR, and XNOR operations; a new capacitive weighting module is introduced to reduce the area of conventional ladder capacitors; and a redundant array-assisted Analog-to-Digital Converter (ADC) is proposed to improve linearity during ADC quantization. The proposed architecture can achieve multi-bit multiplication and accumulation (MAC), OR accumulation (ORA), and XNOR accumulation (XNORA). Simulated using a 28-nm CMOS process, the architecture demonstrated a minor standard deviation in BL voltage of 16.27 mV at the SS process corner, as evidenced by Monte Carlo simulation. At the TT process corner, the energy expenditure for MAC, XNORA, and ORA operations was 5.76, 5.85, and 5.82 fJ/op, respectively.</p></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":null,"pages":null},"PeriodicalIF":1.9000,"publicationDate":"2024-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239124001012","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In the emerging field of Computing-in-Memory (CIM), this study introduces a 28-nm CMOS-based Static Random Access Memory (SRAM) CIM macro capable of various computational modes, potentially offering a solution to the Von Neumann bottleneck. Beyond traditional SRAM read and write operations, to enhance the flexibility of the CIM macro, a 9T cell is proposed for performing AND, OR, and XNOR operations; a new capacitive weighting module is introduced to reduce the area of conventional ladder capacitors; and a redundant array-assisted Analog-to-Digital Converter (ADC) is proposed to improve linearity during ADC quantization. The proposed architecture can achieve multi-bit multiplication and accumulation (MAC), OR accumulation (ORA), and XNOR accumulation (XNORA). Simulated using a 28-nm CMOS process, the architecture demonstrated a minor standard deviation in BL voltage of 16.27 mV at the SS process corner, as evidenced by Monte Carlo simulation. At the TT process corner, the energy expenditure for MAC, XNORA, and ORA operations was 5.76, 5.85, and 5.82 fJ/op, respectively.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.