Design of interpenetration network in light-based 3D printing for robust and sustainable dielectric insulators

IF 5 2区 材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING
Yingfan Zhang, Zhengyong Huang, Run He, Teng Zhao, Chenxin Li, Jian Li
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引用次数: 0

Abstract

The sustainability and additive manufacturing of dielectric insulators are the development direction of the power system. Introducing dynamic covalent bonds in light-based 3D printing have attracted considerable attention as the reversible crosslinks allow for the reprocessing of printed objects. However, there generally exists a trade-off between mechanical strength, glass transition temperature (Tg), and reconfigurability for dynamic covalent networks. The reconfiguring process of the dynamic covalent network often requires high mobility of molecular chains and large free volumes, which in turn decreases the mechanical strength, Tg, and electrical insulating performance. Herein, we demonstrate a novel strategy for developing a kind of mechanically robust and sustainable vitrimer by building a rigid-flexible coupling inter-penetration network (IPN). Specifically, a two-stage curing approach was used to prepare high-performance 3D-printing vitrimers by using the plant oil-epoxy hybrid resin, which brings a lot of ester bonds and β-hydroxyl ester for the crosslinking network. Computational techniques with molecular dynamics calculation are used for the design and optimization of the crosslinking network, and then the optimized IPN is prepared by digital light processing 3D printing and subsequent heat curing. In the IPN, the epoxy backbone is rigid to enhance the Tg and tensile strength, while the plant-based methacrylate is flexible to guarantee topological rearrangement at elevated temperatures. Compared to reported epoxy vitrimers, the resultant IPN exhibits simultaneous high Tg (111 °C), outstanding tensile strength and toughness (tensile strength of 70 MPa, elongation at break of 17.58 %), good topological rearrangement, and excellent dielectric properties (permittivity less than 4, breakdown strength of 49.3 kV/mm). This work provides a new strategy for balancing the strength, toughness, electrical insulating and sustainability of 3D-printed thermosets.

在光基三维打印技术中设计互穿网络,制造坚固耐用、可持续的介电绝缘体
电介质绝缘体的可持续性和增材制造是电力系统的发展方向。在光基三维打印中引入动态共价键引起了广泛关注,因为可逆交联允许对打印对象进行再加工。然而,动态共价网络通常在机械强度、玻璃化转变温度(Tg)和可重构性之间存在权衡。动态共价网络的重新配置过程往往需要分子链的高流动性和较大的自由体积,这反过来又会降低机械强度、玻璃化温度(Tg)和电绝缘性能。在此,我们展示了一种新颖的策略,即通过构建刚柔耦合穿透间网络(IPN)来开发一种机械坚固且可持续的玻璃聚合物。具体来说,我们采用了两阶段固化法,利用植物油-环氧混合树脂制备了高性能 3D 打印玻璃聚合物,该树脂为交联网络带来了大量酯键和β-羟基酯。利用分子动力学计算技术对交联网络进行设计和优化,然后通过数字光处理三维打印和随后的热固化制备出优化的 IPN。在 IPN 中,环氧树脂骨架是刚性的,以提高 Tg 和拉伸强度,而植物基甲基丙烯酸酯是柔性的,以保证在高温下的拓扑重排。与已报道的环氧玻璃rimers 相比,所制备的 IPN 同时具有较高的 Tg(111 °C)、出色的拉伸强度和韧性(拉伸强度为 70 兆帕,断裂伸长率为 17.58%)、良好的拓扑重排和优异的介电性能(介电常数小于 4,击穿强度为 49.3 千伏/毫米)。这项工作为平衡三维打印热固性材料的强度、韧性、电绝缘性和可持续性提供了一种新策略。
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来源期刊
Polymer Testing
Polymer Testing 工程技术-材料科学:表征与测试
CiteScore
10.70
自引率
5.90%
发文量
328
审稿时长
44 days
期刊介绍: Polymer Testing focuses on the testing, analysis and characterization of polymer materials, including both synthetic and natural or biobased polymers. Novel testing methods and the testing of novel polymeric materials in bulk, solution and dispersion is covered. In addition, we welcome the submission of the testing of polymeric materials for a wide range of applications and industrial products as well as nanoscale characterization. The scope includes but is not limited to the following main topics: Novel testing methods and Chemical analysis • mechanical, thermal, electrical, chemical, imaging, spectroscopy, scattering and rheology Physical properties and behaviour of novel polymer systems • nanoscale properties, morphology, transport properties Degradation and recycling of polymeric materials when combined with novel testing or characterization methods • degradation, biodegradation, ageing and fire retardancy Modelling and Simulation work will be only considered when it is linked to new or previously published experimental results.
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