The Copper Connection: Hybrid Bonding is the 3D-Chip Tech That's Saving Moore's Law

IF 2.6 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Spectrum Pub Date : 2024-09-06 DOI:10.1109/MSPEC.2024.10669241

Samuel K. Moore

引用次数: 0

Abstract

Chipmakers continue to claw for every spare nano-meter to continue scaling down circuits, but a technology involving things that are much bigger—hundreds or thousands of nanometers across—could be just as significant over the next five years.

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铜的连接：混合键合是拯救摩尔定律的 3D 芯片技术

芯片制造商仍在努力争取每一个空余的纳米米，以继续缩小电路的规模，但在未来五年内，一项涉及更大尺寸（直径达数百或数千纳米）的技术可能同样重要。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Spectrum 工程技术-工程：电子与电气

CiteScore

2.50

自引率

0.00%

发文量

254

审稿时长

4-8 weeks

期刊介绍： IEEE Spectrum Magazine, the flagship publication of the IEEE, explores the development, applications and implications of new technologies. It anticipates trends in engineering, science, and technology, and provides a forum for understanding, discussion and leadership in these areas. IEEE Spectrum is the world''s leading engineering and scientific magazine. Read by over 300,000 engineers worldwide, Spectrum provides international coverage of all technical issues and advances in computers, communications, and electronics. Written in clear, concise language for the non-specialist, Spectrum''s high editorial standards and worldwide resources ensure technical accuracy and state-of-the-art relevance.

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