Improvement of ESD Damage Test Board for CMC for Automotive Ethernet

IF 0.9 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Hironori Ito;Yusuke Yano;Takeshi Ishida;Jianqing Wang
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Abstract

IEC 62228-5 requires an electrostatic discharge (ESD) damage test of common-mode chokes (CMCs) used in the electromagnetic compatibility evaluation of automotive Ethernet transceiver integrated circuits (ICs). However, with the recommended ESD damage test board in IEC 62228-5, mounting and remounting of 0- $\Omega $ resistors in the S-parameter measurement route (microstrip lines) are needed, which may cause uncertainty in the S-parameter measurement results. In this letter, we propose and validate an improved ESD damage test board which ensures both S-parameter measurement and ESD application. The proposed test board removed the 0- $\Omega $ resistors and the vias of discharge points (DPs) from the microstrip lines between the SMA connectors for connection to a vector network analyzer and the CMC. As a result, the proposed test board was able to reduce the effects caused by the mismatched parts on the microstrip lines. For validation, ESD current waveforms were measured and compared for the original and proposed test boards, with concern for discharge at the SMA connectors. As a result, the proposed test board shows almost the same discharge current waveform as the original test board. In addition, based on the relationship between the applied ESD voltage and the first peak of the discharge current, determining whether a discharge occurs at the SMA connector on the DP side was examined. The result confirmed that the first-order proportional relationship between the ESD voltage and the first discharge peak current was maintained for the proposed test board, which suggests the validity of the proposed test board for the ESD damage test.
改进用于汽车以太网 CMC 的 ESD 损坏测试板
IEC 62228-5 要求对用于汽车以太网收发器集成电路(IC)电磁兼容性评估的共模扼流圈(CMC)进行静电放电(ESD)损坏测试。然而,使用 IEC 62228-5 中推荐的 ESD 损坏测试板时,需要在 S 参数测量路线(微带线)上安装和重新安装 0- $\Omega $ 电阻器,这可能会导致 S 参数测量结果的不确定性。在这封信中,我们提出并验证了一种改进的 ESD 损坏测试板,它能同时确保 S 参数测量和 ESD 应用。建议的测试板去掉了 SMA 连接器之间微带线上的 0- $\Omega $ 电阻和放电点(DP)通孔,以便连接到矢量网络分析仪和 CMC。因此,建议的测试板能够减少微带线上不匹配部件造成的影响。为了进行验证,对原始测试板和建议的测试板的 ESD 电流波形进行了测量和比较,并关注 SMA 连接器的放电情况。结果显示,建议的测试板与原始测试板的放电电流波形几乎相同。此外,根据施加的 ESD 电压与放电电流第一个峰值之间的关系,还检查了 DP 侧 SMA 连接器是否发生放电。结果证实,在拟议的测试板上,ESD 电压和第一个放电峰值电流之间保持了一阶比例关系,这表明拟议的测试板在 ESD 损坏测试中是有效的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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