Yuqing Huang , Yanwei Sun , Jubing Xu , XiangZhan Hu , Yinshui Xia , Xiudeng Wang , Huakang Xia , Siguang An , Ge Shi
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引用次数: 0
Abstract
A piezoelectric-electromagnetic collaborative energy extraction circuit (PEC-EC) is presented in this paper to extract low-frequency vibration energy from arm swinging for wearable devices. This circuit simultaneously harvests energy from both the piezoelectric transducer (PZT) and electromagnetic coil generator (ECG). When the piezoelectric output voltage reaches its peak, the peak detection circuit becomes conductive, and the energy of the piezoelectric material is extracted at this moment. At the same time, the PEC-EC circuit can also harvest electromagnetic energy. Especially, even at low electromagnetic voltage input, the electromagnetic voltage can be extracted through the designed switch. The experimental results show that the circuit starts up only when the input voltage reaches 0.5V. The electromagnetic energy conversion efficiency can reach 53 %, and the piezoelectric energy conversion efficiency can reach 56 %. The effectiveness of collaborative extraction was also verified through experimental validation.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.