Numerical study of transpiration cooling at different outlet angles and hole pattern

IF 2.6 3区 工程技术 Q2 ENGINEERING, MECHANICAL
Xiaojuan Wang, Xiaoqiang Fan, Bing Xiong
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引用次数: 0

Abstract

The effects of transpiration cooling depends on the distribution of micropores in porous materials. The work simplifies the porous medium to a micro-scale pore plate structure that is densely organized, based on the idea of the capillary bundle model. The effects of hole pattern and hole outlet angle on transpiration cooling are investigated using numerical simulation. It is discovered that the hole outlet angle mostly affects the homogeneity of temperature distribution and has minimal effect on the surface cooling efficiency. The temperature uniformity index dropped by 35.9% yet the surface cooling efficiency only declined by 1.1% when the outlet angle was lowered from 45° to −45°. Furthermore, the temperature uniformity and cooling efficiency are directly affected by the hole pattern. When the long axis of the elliptical hole is parallel to the mainstream, it can achieve the best temperature uniformity; however, when the long axis is perpendicular to the mainstream direction, it can achieve higher cooling efficiency. Third, the material’s permeability will be decreased to varying degrees depending on the hole pattern and hole outlet angle. The results have important reference significance for the design of porous materials used for transpiration cooling.

不同出口角度和孔型下蒸腾冷却的数值研究
蒸腾冷却效果取决于多孔材料中的微孔分布。该研究基于毛细管束模型的思想,将多孔介质简化为组织致密的微尺度孔板结构。通过数值模拟研究了孔型和孔出口角对蒸腾冷却的影响。结果发现,孔出口角度主要影响温度分布的均匀性,对表面冷却效率的影响很小。当出风口角度从 45° 降低到 -45° 时,温度均匀性指数下降了 35.9%,而表面冷却效率仅下降了 1.1%。此外,温度均匀性和冷却效率还直接受到孔型的影响。当椭圆孔的长轴平行于主流方向时,温度均匀性最好;而当长轴垂直于主流方向时,冷却效率更高。第三,根据孔型和孔出口角度的不同,材料的渗透率会有不同程度的下降。这些结果对用于蒸发冷却的多孔材料的设计具有重要的参考意义。
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来源期刊
International Journal of Heat and Fluid Flow
International Journal of Heat and Fluid Flow 工程技术-工程:机械
CiteScore
5.00
自引率
7.70%
发文量
131
审稿时长
33 days
期刊介绍: The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.
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