Epoxy curing in mild and eco-friendly conditions: Towards bisphenol A-free systems

IF 26 1区 化学 Q1 POLYMER SCIENCE
Valentine Lavaux , Jacques Lalevée
{"title":"Epoxy curing in mild and eco-friendly conditions: Towards bisphenol A-free systems","authors":"Valentine Lavaux ,&nbsp;Jacques Lalevée","doi":"10.1016/j.progpolymsci.2024.101873","DOIUrl":null,"url":null,"abstract":"<div><p>Epoxy resins rank among the most significantly used thermosets, showing high thermal and mechanical properties. Unfortunately, current polymerization processes to reach these properties are energy-intensive, characterized by high temperatures and long processing duration. Addressing this problem, recent years have witnessed the emergence of curing methods under mild and ecofriendly conditions, aligning with societal and ecological challenges. Mild conditions were delineated in this review as a polymerization without solvent and at temperatures not exceeding 80 °C. This work highlights three methods, by focusing on research works from 2015 to date: i) polyadditions via step-growth ring opening polymerization, ii) photopolymerization leading to homopolymerization of bio-based monomers and iii) redox polymerization achieved through the release of cations or acidic protons species, initiating the cationic polymerization. In the context of ecofriendly conditions, the replacement of bisphenol-A present in many epoxy monomers is also a huge challenge to keep both good mechanical properties and fast polymerization kinetics. In this context, this review aims at underlining the increasing importance of epoxy curing under mild conditions, in possible combination with bio-based monomers for bisphenol-A replacement and to guide both researchers and industries to explore and develop new curing systems.</p></div>","PeriodicalId":413,"journal":{"name":"Progress in Polymer Science","volume":"157 ","pages":"Article 101873"},"PeriodicalIF":26.0000,"publicationDate":"2024-08-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S007967002400090X/pdfft?md5=fb9018d6ff23f66aa6247298b24f94dc&pid=1-s2.0-S007967002400090X-main.pdf","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Progress in Polymer Science","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S007967002400090X","RegionNum":1,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0

Abstract

Epoxy resins rank among the most significantly used thermosets, showing high thermal and mechanical properties. Unfortunately, current polymerization processes to reach these properties are energy-intensive, characterized by high temperatures and long processing duration. Addressing this problem, recent years have witnessed the emergence of curing methods under mild and ecofriendly conditions, aligning with societal and ecological challenges. Mild conditions were delineated in this review as a polymerization without solvent and at temperatures not exceeding 80 °C. This work highlights three methods, by focusing on research works from 2015 to date: i) polyadditions via step-growth ring opening polymerization, ii) photopolymerization leading to homopolymerization of bio-based monomers and iii) redox polymerization achieved through the release of cations or acidic protons species, initiating the cationic polymerization. In the context of ecofriendly conditions, the replacement of bisphenol-A present in many epoxy monomers is also a huge challenge to keep both good mechanical properties and fast polymerization kinetics. In this context, this review aims at underlining the increasing importance of epoxy curing under mild conditions, in possible combination with bio-based monomers for bisphenol-A replacement and to guide both researchers and industries to explore and develop new curing systems.

Abstract Image

在温和、环保的条件下固化环氧树脂:实现无双酚 A 系统
环氧树脂是最常用的热固性材料之一,具有很高的热性能和机械性能。遗憾的是,目前达到这些性能的聚合工艺都是高能耗的,其特点是温度高、加工时间长。为解决这一问题,近年来出现了温和环保的固化方法,以应对社会和生态挑战。在本综述中,温和条件被定义为无溶剂、温度不超过 80 °C 的聚合。这项工作重点关注 2015 年至今的研究成果,重点介绍了三种方法:i) 通过阶跃生长开环聚合实现加成;ii) 光聚合导致生物基单体均聚化;iii) 通过释放阳离子或酸性质子物种实现氧化还原聚合,从而引发阳离子聚合。在生态友好的条件下,要保持良好的机械性能和快速的聚合动力学,替代许多环氧单体中的双酚 A 也是一个巨大的挑战。在此背景下,本综述旨在强调环氧树脂在温和条件下固化的重要性,并可能结合生物基单体来替代双酚-A,引导研究人员和工业界探索和开发新的固化体系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Progress in Polymer Science
Progress in Polymer Science 化学-高分子科学
CiteScore
48.70
自引率
1.10%
发文量
54
审稿时长
38 days
期刊介绍: Progress in Polymer Science is a journal that publishes state-of-the-art overview articles in the field of polymer science and engineering. These articles are written by internationally recognized authorities in the discipline, making it a valuable resource for staying up-to-date with the latest developments in this rapidly growing field. The journal serves as a link between original articles, innovations published in patents, and the most current knowledge of technology. It covers a wide range of topics within the traditional fields of polymer science, including chemistry, physics, and engineering involving polymers. Additionally, it explores interdisciplinary developing fields such as functional and specialty polymers, biomaterials, polymers in drug delivery, polymers in electronic applications, composites, conducting polymers, liquid crystalline materials, and the interphases between polymers and ceramics. The journal also highlights new fabrication techniques that are making significant contributions to the field. The subject areas covered by Progress in Polymer Science include biomaterials, materials chemistry, organic chemistry, polymers and plastics, surfaces, coatings and films, and nanotechnology. The journal is indexed and abstracted in various databases, including Materials Science Citation Index, Chemical Abstracts, Engineering Index, Current Contents, FIZ Karlsruhe, Scopus, and INSPEC.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信