Wide scan angle multibeam conformal antenna array with novel feeding for mm-wave 5G applications

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
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引用次数: 0

Abstract

This paper presents a low-profile wide scan angle multibeam conformal antenna array system with a novel feeding network for 28 GHz mm-wave 5G applications. The proposed antenna system utilizes two conventional branch-line couplers as its beamforming network. A novel feeding technique is applied to generate 7 beams with these couplers that are usually capable of generating 2 beams. The proposed solution provides a wide scanning range with a minimum realized gain of 5 dBi from 90° to 90° owing to this feeding approach and the peculiar placement of the array elements on a 0.15 mm thick R-F775 bendable substrate. The generated beams at their steer direction have the minimum and maximum gain values of 6.5 dBi and 9.7 dBi, respectively. A low-cost PCB manufacturing technique based on soft lithography and wet etching is used. The system dimensions excluding extra connector sections are 67×15×3mm3. The proposed flexible design is suitable for lightweight 5G communication systems and handsets with its compact low-complexity beamforming network, and wide 180° continuous covering angle.

Abstract Image

采用新型馈电的宽扫描角多波束共形天线阵列,适用于毫米波 5G 应用
本文针对 28 GHz 毫米波 5G 应用,介绍了一种带有新型馈电网络的低剖面宽扫描角多波束共形天线阵列系统。拟议的天线系统采用两个传统的分支线耦合器作为波束成形网络。这些耦合器通常只能产生 2 个波束,而利用新型馈电技术可产生 7 个波束。由于采用了这种馈电方法,并在 0.15 毫米厚的 R-F775 可弯曲基板上布置了独特的阵列元件,因此所提出的解决方案扫描范围很宽,从 -90° 到 90° 的最小实现增益为 5 dBi。在转向方向上产生的波束的最小和最大增益值分别为 6.5 dBi 和 9.7 dBi。该系统采用了基于软光刻和湿法蚀刻的低成本印刷电路板制造技术。系统尺寸(不包括额外的连接器部分)为 67×15×3mm3。所提出的灵活设计适用于轻量级 5G 通信系统和手机,具有紧凑、低复杂度波束成形网络和宽 180° 连续覆盖角。
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来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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