Adel Ashery, Ahmed E H Gaballah, Gamal M Turky, Mohamed A Basyooni-Murat Kabatas
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引用次数: 0
Abstract
The current work presents a new structure based on Au/PVA/SiO2/p-Si/Al that has not been studied before. An aqueous solution of polyvinyl alcohol (PVA) polymer gel was deposited on the surface of SiO2/Si using the spin-coating technique. The silicon wafer was left to be oxidized in a furnace at 1170 k for thirty minutes, creating an interdiffusion layer of SiO2. The variations in the dielectric constant (Є'), dielectric loss (Є″), and dielectric tangent (tanδ) with the change in the frequency, voltage, and temperature were analyzed. The results showed an increase in the dielectric constant (Є') and a decrease in the dielectric loss (Є″) and tangent (tanδ); thus, the Au/PVA/SiO2/p-Si/Al heterostructure has opened up new frontiers for the semiconductor industry, especially for capacitor manufacturing. The Cole-Cole diagrams of the Є″ and Є' have been investigated at different temperatures and voltages. The ideality factor (n), barrier height (Φb), series resistance (Rs), shunt resistance (Rsh), and rectification ratio (RR) were also measured at different temperatures.
期刊介绍:
The journal Gels (ISSN 2310-2861) is an international, open access journal on physical (supramolecular) and chemical gel-based materials. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. Therefore, there is no restriction on the maximum length of the papers, and full experimental details must be provided so that the results can be reproduced. Short communications, full research papers and review papers are accepted formats for the preparation of the manuscripts.
Gels aims to serve as a reference journal with a focus on gel materials for researchers working in both academia and industry. Therefore, papers demonstrating practical applications of these materials are particularly welcome. Occasionally, invited contributions (i.e., original research and review articles) on emerging issues and high-tech applications of gels are published as special issues.