Peng He , Qingqing Zhou , Yong Li , Qi Liu , Feng Tao , Maosheng Cao
{"title":"3D MXene architectures for electromagnetic protection","authors":"Peng He , Qingqing Zhou , Yong Li , Qi Liu , Feng Tao , Maosheng Cao","doi":"10.1016/j.carbon.2024.119564","DOIUrl":null,"url":null,"abstract":"<div><p>Electromagnetic (EM) pollution is becoming increasingly severe due to the explosive growth of various communication devices. EM protection materials are the key to solving EM pollution. MXenes, by virtue of larger specific surface area, numerous surface functional groups and excellent conductivity, are attracting increasing attention and showing competitive performance in EM protection. By constructing 3D MXene architectures, not only can the EM protection performance be significantly improved, but it can also meet the development needs of lightweight, miniaturization, and portability in the future. In this review, we summarized the methods for preparing 3D MXene architectures applied in the field of EM protection. Then, we comprehensively elaborate on the structure-property relationships of 3D MXene architectures and their applications in microwave absorption (MA) and electromagnetic interference (EMI) shielding. Finally, we discuss the challenges and opportunities in the development of 3D MXene architectures for EM protection.</p></div>","PeriodicalId":262,"journal":{"name":"Carbon","volume":"229 ","pages":"Article 119564"},"PeriodicalIF":10.5000,"publicationDate":"2024-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Carbon","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0008622324007838","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
Electromagnetic (EM) pollution is becoming increasingly severe due to the explosive growth of various communication devices. EM protection materials are the key to solving EM pollution. MXenes, by virtue of larger specific surface area, numerous surface functional groups and excellent conductivity, are attracting increasing attention and showing competitive performance in EM protection. By constructing 3D MXene architectures, not only can the EM protection performance be significantly improved, but it can also meet the development needs of lightweight, miniaturization, and portability in the future. In this review, we summarized the methods for preparing 3D MXene architectures applied in the field of EM protection. Then, we comprehensively elaborate on the structure-property relationships of 3D MXene architectures and their applications in microwave absorption (MA) and electromagnetic interference (EMI) shielding. Finally, we discuss the challenges and opportunities in the development of 3D MXene architectures for EM protection.
期刊介绍：
The journal Carbon is an international multidisciplinary forum for communicating scientific advances in the field of carbon materials. It reports new findings related to the formation, structure, properties, behaviors, and technological applications of carbons. Carbons are a broad class of ordered or disordered solid phases composed primarily of elemental carbon, including but not limited to carbon black, carbon fibers and filaments, carbon nanotubes, diamond and diamond-like carbon, fullerenes, glassy carbon, graphite, graphene, graphene-oxide, porous carbons, pyrolytic carbon, and other sp2 and non-sp2 hybridized carbon systems. Carbon is the companion title to the open access journal Carbon Trends. Relevant application areas for carbon materials include biology and medicine, catalysis, electronic, optoelectronic, spintronic, high-frequency, and photonic devices, energy storage and conversion systems, environmental applications and water treatment, smart materials and systems, and structural and thermal applications.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
