{"title":"A vertical transition for suspended line with two transition modes","authors":"Liwei Yan, Zhanyi Fu, Yang Kuai, Jie Ma, Fei Yang","doi":"10.1016/j.aeue.2024.155478","DOIUrl":null,"url":null,"abstract":"<div><p>In this article, we propose a substrate-integrated suspended line (SISL) vertical transition for chip packaging. The transition structure supports both counter-directional and co-directional modes for single-module packaging and vertical integration, respectively. Furthermore, the incorporation of an electromagnetic band gap (EBG) reduces the demands on substrate electrical contact and simplifies the assembly process. A transition structure was designed to convert SISL to a grounded coplanar waveguide (GCPW) to facilitate measurement. The overall structure can be implemented using cost-effective printed circuit board (PCB) technology. Two prototypes of this transition were designed and fabricated. In the frequency range of 12–18 GHz, corresponding to a fractional bandwidth of 40%, the measured return loss is better than 12 dB, while the insertion loss remains consistently below 2.2 dB.</p></div>","PeriodicalId":50844,"journal":{"name":"Aeu-International Journal of Electronics and Communications","volume":"186 ","pages":"Article 155478"},"PeriodicalIF":3.0000,"publicationDate":"2024-08-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Aeu-International Journal of Electronics and Communications","FirstCategoryId":"94","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1434841124003649","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this article, we propose a substrate-integrated suspended line (SISL) vertical transition for chip packaging. The transition structure supports both counter-directional and co-directional modes for single-module packaging and vertical integration, respectively. Furthermore, the incorporation of an electromagnetic band gap (EBG) reduces the demands on substrate electrical contact and simplifies the assembly process. A transition structure was designed to convert SISL to a grounded coplanar waveguide (GCPW) to facilitate measurement. The overall structure can be implemented using cost-effective printed circuit board (PCB) technology. Two prototypes of this transition were designed and fabricated. In the frequency range of 12–18 GHz, corresponding to a fractional bandwidth of 40%, the measured return loss is better than 12 dB, while the insertion loss remains consistently below 2.2 dB.
期刊介绍:
AEÜ is an international scientific journal which publishes both original works and invited tutorials. The journal''s scope covers all aspects of theory and design of circuits, systems and devices for electronics, signal processing, and communication, including:
signal and system theory, digital signal processing
network theory and circuit design
information theory, communication theory and techniques, modulation, source and channel coding
switching theory and techniques, communication protocols
optical communications
microwave theory and techniques, radar, sonar
antennas, wave propagation
AEÜ publishes full papers and letters with very short turn around time but a high standard review process. Review cycles are typically finished within twelve weeks by application of modern electronic communication facilities.