High-Temperature-Resistant Polymer-Based 3-D-Printed Electromagnetic Scanning Micromirror

IF 2.2 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Yongseung Lee;Yong-Kweon Kim;Chang-Hyeon Ji
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Abstract

In this letter, we present an electromagnetic scanning micromirror fabricated using 3-D printing with a high-temperature-resistant polymer. The micromirror comprises a 1-D scanning mechanism featuring a large gold-coated silicon mirror, supported by a 3-D-printed structural layer consisting of a mirror holder, gimbal, and two sets of torsion springs. The design incorpora- tes a series-connected dual spring–mass–damper system to enhance the optical scan angle at resonance. Actuation is achieved via Lorentz force applied to a self-supported coil inserted into the gimbal. The reflective surface has roun- ded edges and an outer dimension of 4.2 × 15 mm 2 . Permanent magnets are assembled with an aluminum jig on either side of the mirror holder, with a minimal gap of 0.55 mm. The device is fabri- cated using three different 3-D printing methods (digital light processing (DLP), fused deposition modeling, and stereolithography) and four different materials and subsequently tested. Among the fabricated devices, the one printed via DLP 3-D printing achieved a maximum optical scan angle of 20° at 1248 Hz, with an input current of 110 mA rms . Various characteristics of the 3-D-printed and assembled devices, including dimensional accuracy, surface topography, temperature effects, and driving characteristics, were analyzed. The fabricated micromirror can be integrated into a 2-D scanning module for light detection and ranging systems.
基于耐高温聚合物的三维打印电磁扫描微镜
在这封信中,我们介绍了一种使用耐高温聚合物的三维打印技术制造的电磁扫描微镜。该微镜包括一个一维扫描机构,其特点是一个大型镀金硅镜,由一个三维打印结构层支撑,该结构层包括一个镜架、万向节和两组扭转弹簧。该设计采用了串联双弹簧-质量-阻尼系统,以增强共振时的光学扫描角度。通过对插入万向节的自支撑线圈施加洛伦兹力来实现驱动。反射表面边缘粗糙,外部尺寸为 4.2 × 15 mm2。永久磁铁与铝夹具装配在镜架两侧,间隙最小为 0.55 毫米。该装置采用三种不同的三维打印方法(数字光处理(DLP)、熔融沉积建模和立体光刻)和四种不同的材料制造而成,随后进行了测试。在制作的器件中,采用 DLP 三维打印技术的器件在输入电流为 110 mArms 的情况下,以 1248 Hz 的频率实现了 20° 的最大光学扫描角度。分析了三维打印和组装器件的各种特性,包括尺寸精度、表面形貌、温度影响和驱动特性。制造的微镜可集成到光探测和测距系统的二维扫描模块中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Sensors Letters
IEEE Sensors Letters Engineering-Electrical and Electronic Engineering
CiteScore
3.50
自引率
7.10%
发文量
194
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