On plasticity-enhanced interfacial toughness in bonded joints

IF 3.4 3区 工程技术 Q1 MECHANICS
E.D. Reedy, F.W. DelRio, B.D. Clarke, S.J. Grutzik
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Abstract

The performance and reliability of many structures and components depend on the integrity of interfaces between dissimilar materials. Interfacial toughness Γ is the key material parameter that characterizes resistance to interfacial crack growth, and Γ is known to depend on many factors including temperature. For example, previous work showed that the toughness of an epoxy/aluminum interface decreased 40 % as the test temperature was increased from −60 °C to room temperature (RT). Interfacial integrity at elevated temperatures is of considerable practical importance. Recent measurements show that instead of continuing to decrease with increasing temperature, Γ increases when test temperature is above RT. Cohesive zone finite element calculations of an adhesively bonded, asymmetric double cantilever beam specimen of the type used to measure Γ suggest that this increase in toughness may be a result of R-curve behavior generated by plasticity-enhanced toughening during stable subcritical crack growth with interfacial toughness defined as the critical steady-state limit value. In these calculations, which used an elastic-perfectly plastic epoxy model with a temperature-dependent yield strength, the plasticity-enhanced increase in Γ above its intrinsic value Γo depended on the ratio of interfacial strength σ* to the yield strength σyb of the bond material. There is a nonlinear relationship between Γ/Γo and σ*/σyb with the value Γ/Γo increasing rapidly above a threshold value of σ*/σyb. The predicted increase in toughness can be significant. For example, there is nearly a factor of two predicted increase in Γ/Γo during micrometer-scale crack-growth when σ*/σyb = 2 (a reasonable choice for σ*/σyb). Furthermore, contrary to other reported results, plasticity-enhanced toughening can occur prior to crack advance as the cohesive zone forms and the peak stress at the tip of the original crack tip translates to the tip of the fully formed cohesive zone. These results suggest that plasticity-enhanced toughening should be considered when modeling interfaces at elevated temperatures.

关于粘接接头中塑性增强的界面韧性
许多结构和部件的性能和可靠性取决于不同材料之间界面的完整性。界面韧性 Γ 是表征界面裂纹生长阻力的关键材料参数,已知 Γ 与包括温度在内的许多因素有关。例如,之前的研究表明,当测试温度从 -60 °C 升至室温 (RT) 时,环氧树脂/铝界面的韧性降低了 40%。高温下的界面完整性具有相当重要的实际意义。最近的测量结果表明,当测试温度高于室温时,Γ 不仅不会随温度升高而继续降低,反而会升高。对用于测量 Γ 的粘合剂粘接的不对称双悬臂梁试样进行的粘合区有限元计算表明,韧性的增加可能是在稳定的亚临界裂纹生长过程中塑性增强增韧产生的 R 曲线行为的结果,界面韧性被定义为临界稳态极限值。在这些计算中,使用了屈服强度随温度变化的弹性完全塑性环氧模型,塑性增强的 Γ 在其固有值 Γo 以上的增加取决于界面强度 σ* 与粘结材料屈服强度 σyb 的比率。Γ/Γo 与 σ*/σyb 之间存在非线性关系,Γ/Γo 值在超过 σ*/σyb 临界值时迅速增加。预测的韧性增加可能非常显著。例如,当 σ*/σyb = 2(σ*/σyb 的合理选择)时,在微米尺度的裂纹生长过程中,Γ/Γo 的预测值增加了近 2 倍。此外,与其他报告结果相反,塑性增强增韧可在裂纹扩展之前发生,因为内聚区形成,原始裂纹尖端的峰值应力转化为完全形成的内聚区尖端。这些结果表明,在对高温下的界面进行建模时,应考虑塑性增强增韧。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
6.70
自引率
8.30%
发文量
405
审稿时长
70 days
期刊介绍: The International Journal of Solids and Structures has as its objective the publication and dissemination of original research in Mechanics of Solids and Structures as a field of Applied Science and Engineering. It fosters thus the exchange of ideas among workers in different parts of the world and also among workers who emphasize different aspects of the foundations and applications of the field. Standing as it does at the cross-roads of Materials Science, Life Sciences, Mathematics, Physics and Engineering Design, the Mechanics of Solids and Structures is experiencing considerable growth as a result of recent technological advances. The Journal, by providing an international medium of communication, is encouraging this growth and is encompassing all aspects of the field from the more classical problems of structural analysis to mechanics of solids continually interacting with other media and including fracture, flow, wave propagation, heat transfer, thermal effects in solids, optimum design methods, model analysis, structural topology and numerical techniques. Interest extends to both inorganic and organic solids and structures.
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