Guest Editorial for Special Issue on Papers From 2023 IEEE International Conference on Flexible Printable Sensors and Systems (FLEPS)

IEEE Journal on Flexible Electronics Pub Date : 2024-03-01 DOI:10.1109/JFLEX.2024.3426128

Tse Nga Ng;Matti Mäntysalo;Shweta Agarwala;Benjamin Tee;Woo Soo Kim;Gerd Grau

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Abstract

This Special Issue of the IEEE Journal on Flexible Electronics (J-FLEX) showcases the expanded papers presented at the 2023 IEEE International Conference on Flexible Printable Sensors and Systems (FLEPS), held in Boston, MA, USA. FLEPS was organized by the IEEE Sensors Council. The advancements in flexibility and printability are reshaping the landscape of electronic device design and production, sparking great enthusiasm globally for the field of flexible and printable electronics. FLEPS served as an excellent platform for engaging in discussions about the latest advancements in the field and shaping future pathways for sensors utilizing unconventional materials and manufacturing technologies. FLEPS garnered an enthusiastic response, attracting leading experts, researchers, and innovators from both academia and industry. The technical program of FLEPS 2023 comprised over 150 presentations spanning three days. Submitted papers underwent a rigorous peer-review process. The authors whose papers were accepted were encouraged to submit extended versions for consideration, hence the creation of this special issue.

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2023 年电气和电子工程师学会柔性可印刷传感器与系统（FLEPS）国际会议论文特刊客座编辑

本期《IEEE 柔性电子学报》（J-FLEX）特刊展示了在美国马萨诸塞州波士顿举行的 2023 年 IEEE 柔性可印刷传感器与系统国际会议（FLEPS）上发表的扩展论文。FLEPS 由 IEEE 传感器理事会主办。柔性和可印刷性的进步正在重塑电子设备设计和生产的格局，激发了全球对柔性和可印刷电子领域的极大热情。FLEPS 为讨论该领域的最新进展以及利用非常规材料和制造技术打造传感器的未来之路提供了一个绝佳的平台。FLEPS 获得了热烈反响，吸引了来自学术界和工业界的顶尖专家、研究人员和创新者。FLEPS 2023 的技术项目包括 150 多场演讲，为期三天。提交的论文都经过了严格的同行评审。我们鼓励论文被录用的作者提交扩展版本以供审议，这就是本特刊的由来。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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IEEE Journal on Flexible Electronics

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