Effects of Print Orientation on Mode-I Fracture Toughness of Additively Manufactured PLA: Simulation by XFEM

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Abstract

In engineering applications, considering the growing utilization of Polylactic acid (PLA) material manufactured through material extrusion (MEX) additive manufacturing techniques, it becomes imperative to predict its fracture behavior to assess damage thoroughly under various loading scenarios. As an initial step, this study focuses on determining the Mode-I fracture toughness of the PLA material manufactured by MEX in three different print orientations through a three-point (3P) bending fracture test. The raster angle utilized to fabricate the single-edge notch bending (SENB) specimens was chosen as ±45°. Three different print orientations were used to investigate the effects of printing direction (i.e., horizontal, lateral, and vertical) on the fracture properties. The fracture properties were extracted per the standard ASTM D5045-14 on the specimens fabricated in three different print orientations. The values of Mode-I fracture toughness of PLA were respectively obtained as 4.22, 4.18, and 3.56 MPa/m with horizontal, lateral, and vertical print orientation. Then, corresponding fracture energy values were calculated for numerical investigations. A commercial finite element package was utilized to employ the extracted values into the extended finite element method (XFEM) and investigate the crack propagation in the specimens. It was found that the numerical analyses well simulated the crack propagation and peak load (damage initiation point) experienced in the SENB specimens tested under 3P bending loading.

打印方向对增材制造聚乳酸 Mode-I 断裂韧性的影响:XFEM 仿真
在工程应用中,考虑到通过材料挤压(MEX)增材制造技术制造的聚乳酸(PLA)材料的使用率越来越高,预测其断裂行为以彻底评估各种加载情况下的损伤变得势在必行。作为第一步,本研究的重点是通过三点(3P)弯曲断裂测试,确定通过 MEX 制造的聚乳酸材料在三种不同打印方向上的 Mode-I 断裂韧性。用于制作单边缺口弯曲(SENB)试样的光栅角度选择为±45°。三种不同的印刷方向用于研究印刷方向(即水平、横向和垂直)对断裂特性的影响。根据 ASTM D5045-14 标准提取了三种不同印刷方向试样的断裂性能。在水平、横向和垂直印刷方向上,聚乳酸的模式 I 断裂韧性值分别为 4.22、4.18 和 3.56 MPa/m。然后,计算出相应的断裂能值,用于数值研究。利用商业有限元软件包将提取的数值应用到扩展有限元法(XFEM)中,并研究试样中的裂纹扩展。结果发现,数值分析很好地模拟了在 3P 弯曲加载下测试的 SENB 试样的裂纹扩展和峰值载荷(损伤起始点)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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