A Hardware and Software Co-Design for Energy-Efficient Neural Network Accelerator With Multiplication-Less Folded-Accumulative PE for Radar-Based Hand Gesture Recognition
IF 2.8 2区 工程技术Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
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引用次数: 0
Abstract
This work presents a novel lightweight neural network (NN) model and a dedicated NN accelerator for radar-based hand gesture recognition (HGR). The NN model employs symmetric weights, group 1-D-convolution, and power-of-two (POT) quantization, achieving 92.84% accuracy on a public dataset with only 4.8 k parameters, while reducing parameter storage by 40%. The custom accelerator features a multiplication-less folded-accumulative processing element (PE), group-wise computation optimization, and an efficient scheduling mechanism for fully connected (FC) layers. Implemented on a Xilinx field-programmable gate array (FPGA) board XC7S15 and 65-nm CMOS technology, it surpasses existing solutions in power efficiency and cost-effectiveness, addressing the computational demands for IoT deployment.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.