Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints

IF 2.2 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Electronic Materials Pub Date : 2024-08-06 DOI:10.1007/s11664-024-11350-z

W. T. Zhao, J. Ren, M. L. Huang

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Abstract

The microstructural evolution and mechanical properties of Sn-52In/Sn-3.0Ag-0.5Cu hybrid solder joints soldered at different reflow temperatures (150°C, 175°C, 200°C) were investigated. The mixed percentage of as-soldered hybrid solder joints increased with increasing reflow temperature. With increasing mixed percentage, finely dispersed Ag₂In and Ag₃Sn particles led to significant refinement of the size of β-Sn grains, and consequently, the combined effect of fine grain strengthening and second-phase dispersion strengthening improved the shear strength, ductility, and fracture energy of the hybrid solder joints. The fracture site of the hybrid solder joints shifted from the Cu₆(Sn, In)₅ intermetallic compound (IMC)/solder interface to the mixed zone of the solder, and the fine β-Sn grains attenuated crack propagation, enabling more fracture energy to be absorbed before fracture. The hybrid solder joint with 100% mixed percentage exhibited the highest shear strength of 87.8 MPa, highest displacement of 251 μm, and highest fracture energy of 1.4 J.

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混合比例对 Sn-52In/Sn-3.0Ag-0.5Cu 混合焊点微观结构和机械性能的影响

研究了在不同回流焊温度（150°C、175°C 和 200°C）下焊接的锡-52In/锡-3.0Ag-0.5Cu 混合焊点的微观结构演变和机械性能。随着回流焊温度的升高，混合焊点的混合比例也随之增加。随着混合比例的增加，细分散的 Ag2In 和 Ag3Sn 颗粒使 β-Sn 晶粒尺寸显著细化，因此，细晶粒强化和第二相分散强化的共同作用提高了混合焊点的剪切强度、延展性和断裂能。混合焊点的断裂部位从 Cu6（Sn，In）5 金属间化合物（IMC）/焊料界面转移到了焊料的混合区，细小的 β-Sn 晶粒减弱了裂纹的扩展，使更多的断裂能量在断裂前被吸收。混合比例为 100%的混合焊点表现出最高的剪切强度（87.8 兆帕）、最高的位移（251 微米）和最高的断裂能（1.4 焦耳）。

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来源期刊

Journal of Electronic Materials 工程技术-材料科学：综合

CiteScore

4.10

自引率

4.80%

发文量

693

审稿时长

3.8 months

期刊介绍： The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications. Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field. A journal of The Minerals, Metals & Materials Society.