Enhanced polarization fatigue behavior in lead-free ferroelectric (K, Na)NbO3 thin films by Mn doping

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Nguyen Dang Phu, Xuan Luc Le, Nguyen Xuan Duong
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Abstract

Potassium sodium niobate (KNN) has attracted much interest as a promising lead-free ferroelectric candidate with its excellent physical properties for potential applications to novel nano-devices such as non-volatile ferroelectric memory. However, the use of KNN films in actual devices has been limited due to concerns in operational reliability (i.e., a polarization fatigue property). In this work, we demonstrate the enhancement of a polarization fatigue behavior in KNN thin films by doping of Mn ions. Ferroelectric fatigue is significantly suppressed in 0.4 mol% Mn-doped KNN films compared with pure KNN films. The amounts of mobile charged defects (e.g., oxygen vacancies and hole carriers produced with cation vacancies) are reduced in the presence of multivalent Mn dopants resulting in a decrease of leakage current density. The reduction of charged defect density can weaken the domain wall pinning effect enabling the polarization fatigue to be suppressed in KNN films. Our work is of practical interest for realizing lead-free ferroelectric memory devices with high performance.

Abstract Image

通过掺杂锰增强无铅铁电(K, Na)NbO3 薄膜的极化疲劳行为
铌酸钠钾(KNN)作为一种很有前途的无铅铁电候选材料,以其优异的物理性能在非易失性铁电存储器等新型纳米器件中的潜在应用而备受关注。然而,由于对运行可靠性(即极化疲劳特性)的担忧,KNN 薄膜在实际器件中的应用一直受到限制。在这项工作中,我们展示了通过掺杂锰离子来增强 KNN 薄膜的极化疲劳行为。与纯 KNN 薄膜相比,掺杂 0.4 mol% Mn 的 KNN 薄膜的铁电疲劳明显受到抑制。由于多价锰掺杂剂的存在,移动带电缺陷(如氧空位和阳离子空位产生的空穴载流子)的数量减少,导致漏电流密度降低。带电缺陷密度的降低会削弱畴壁钉化效应,从而抑制 KNN 薄膜中的极化疲劳。我们的研究对实现高性能无铅铁电存储器件具有实际意义。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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