Feasibility and performance of TiCN-based patch antennas for microwave antenna applications

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2024-08-06 DOI:10.1007/s10854-024-13283-z

M. A. Jusoh, N. I. E. Pamin, N. I. Z. Azman, R. Nazlan, S. A. Harun

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Abstract

Titanium Carbonitride (TiCN) offers a wide range of advantages due to its distinctive characteristics. This study investigates the feasibility of utilizing TiCN for microwave antenna applications. This paper describes the whole process, starting with the synthesizing of materials until the fabricating and testing of TiCN-based patch antenna. The TiCN paste was prepared using a hydrothermal method, and its crystallinity was analyzed using X-ray diffraction. The functional group of the TiCN paste was determined through FTIR analysis, while the morphology of the paste was examined using FESEM/EDX. The TiCN paste was applied onto an RT duroid 5880 substrate using screen-printing techniques, resulting in a strong bond between the paste and substrate as confirmed by the adhesion test. The antenna’s performance was evaluated using the Vector Network Analyzer, revealing two resonant frequencies at 9.08 GHz and 16.96 GHz. The return loss values for these frequencies are − 12.10 dB and − 16.25 dB, respectively. A calculated bandwidth of 950 MHz at − 10.00 dB was found for resonant frequency of 16.96 GHz. This performance indicates the promise of TiCN-based patch antennas for wireless communication technologies.

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微波天线应用中基于 TiCN 的贴片天线的可行性和性能

碳氮化钛（TiCN）因其独特的特性而具有广泛的优势。本研究探讨了将 TiCN 用于微波天线应用的可行性。本文介绍了从材料合成到基于 TiCN 的贴片天线的制造和测试的整个过程。采用水热法制备了 TiCN 浆料，并利用 X 射线衍射分析了其结晶度。通过傅立叶变换红外光谱分析确定了 TiCN 浆料的官能团，同时使用 FESEM/EDX 检查了浆料的形态。使用丝网印刷技术将 TiCN 浆料涂在 RT duroid 5880 基板上，经附着力测试证实，浆料与基板之间的粘合力很强。使用矢量网络分析仪对天线的性能进行了评估，发现其谐振频率分别为 9.08 千兆赫和 16.96 千兆赫。这两个频率的回波损耗值分别为 - 12.10 dB 和 - 16.25 dB。共振频率为 16.96 GHz 时，计算带宽为 950 MHz，- 10.00 dB。这一性能表明，基于 TiCN 的贴片天线有望用于无线通信技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.