Fabrication of Ag nanowires and Ag-graphite nanocomposite conductive adhesives by one-step hydrothermal method

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Majid Shokri Doodeji, Amir Afzalzadeh, Mohammad Mahdi Zerafat
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Abstract

Significant advances in electronic industry have led toward the production of lighter, more efficient, and durable electronic components. Tin–lead connections have been the main alternative for electrical connections for several years; however, these have been banned due to enhanced environmental concerns. Therefore, studies have been focused on finding novel materials for electrical connections. Electrically conductive adhesives (ECAs) from polymer nanocomposites have been proposed as the main alternatives. In this study, epoxy-silver nanowires (Ag NWs) nanocomposite was used for this purpose. Ag NWs were synthesized via hydrothermal technique with 130 nm average diameters and ~ 10 μm average lengths. This was compared with Ag-graphite nanocomposite, and the effect of filler content on conductivity was investigated. Both ICA and ACA configurations showed specific characteristics like low sintering temperature and short sintering time. The sintering time was ~ 45 min, and the sintering temperature was ~ 60 °C. ICA and ACA configurations with Ag NW fillers showed the optimal results at 20 wt%. and 50 wt%, respectively, with the resistivity of 0.3 Ω and volume resistivity of 4 × 10–4 Ω cm. Ag-graphite nanocomposite (ACA configuration) showed the best result at 12 wt% with a resistivity of 0.7 Ω.

Abstract Image

一步水热法制备银纳米线和银石墨纳米复合导电胶
电子工业的巨大进步促使人们生产出更轻、更高效、更耐用的电子元件。多年来,锡铅连接一直是电气连接的主要替代品;然而,由于环境问题的加剧,锡铅连接已被禁用。因此,研究的重点是寻找新型电气连接材料。聚合物纳米复合材料导电粘合剂(ECA)已被提出作为主要的替代品。在本研究中,环氧树脂-银纳米线(Ag NWs)纳米复合材料被用于此目的。银纳米线是通过水热技术合成的,平均直径为 130 nm,平均长度约为 10 μm。将其与 Ag 石墨纳米复合材料进行了比较,并研究了填料含量对电导率的影响。ICA 和 ACA 配置都具有烧结温度低、烧结时间短的特点。烧结时间约为 45 分钟,烧结温度约为 60 °C。含有 Ag NW 填料的 ICA 和 ACA 配置分别在 20 wt% 和 50 wt% 时显示出最佳效果,电阻率为 0.3 Ω,体积电阻率为 4 × 10-4 Ω cm。Ag-graphite 纳米复合材料(ACA 配置)在 12 wt%时效果最佳,电阻率为 0.7 Ω。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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