TCBR and TCBD: Evaluation metrics for tamper coincidence problem in fragile image watermarking

IF 5.1 2区 工程技术 Q1 ENGINEERING, MULTIDISCIPLINARY
Afrig Aminuddin , Ferda Ernawan , Danakorn Nincarean , Agit Amrullah , Dhani Ariatmanto
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Abstract

This paper proposed two evaluation metrics of the tamper coincidence in a block map design for image watermarking. These evaluation metrics are called Tamper Coincidence Block Ratio (TCBR) and Tamper Coincidence Block Density (TCBD). A tamper coincidence occurred in image authentication and self-recovery when the recovery data and the original block location were tampered with simultaneously. A high tamper coincidence limits image inpainting’s capability to recover the region, leading to an imprecise recovered image. The ratio and density of the tamper coincidence may significantly affect the final recovered image quality. Previously, researchers mentioned the tamper coincidence in their experiment but did not evaluate it with any metrics. They evaluated the robustness of their technique based on the final recovered image quality using the Peak Signal-to-Noise Ratio (PSNR) and Structural Similarity Index Measure (SSIM). Tamper coincidences are primarily affected by the block map design implemented by the researcher. Thus, TCBR and TCBD provide valuable insight into the block map design’s effectiveness in preventing tamper coincidence. The experimental result shows that the TCBR and TCBD values are inversely proportional to the recovered image quality. A high TCBR and TCBD value leads to low recovered image quality. Therefore, this paper will help the researchers design an effective block map by minimizing the TCBR and TCBD values to obtain the highest recovered image quality.

TCBR 和 TCBD:脆弱图像水印中篡改重合问题的评估指标
本文提出了图像水印块图设计中篡改重合度的两个评估指标。这些评估指标分别称为篡改重合块比率(TCBR)和篡改重合块密度(TCBD)。当恢复数据和原始块位置同时被篡改时,图像认证和自我恢复中就会出现篡改重合。高篡改重合度会限制图像绘制恢复区域的能力,导致恢复的图像不精确。篡改重合度的比例和密度可能会极大地影响最终恢复图像的质量。此前,研究人员在实验中提到了篡改重合度,但没有用任何指标对其进行评估。他们使用峰值信噪比(PSNR)和结构相似性指数测量(SSIM),根据最终恢复的图像质量评估了其技术的鲁棒性。篡改重合度主要受研究人员实施的块图设计的影响。因此,TCBR 和 TCBD 对块图设计在防止篡改重合方面的有效性提供了有价值的见解。实验结果表明,TCBR 和 TCBD 值与恢复的图像质量成反比。TCBR 和 TCBD 值越高,恢复的图像质量越低。因此,本文将帮助研究人员通过最小化 TCBR 和 TCBD 值来设计有效的块图,从而获得最高的恢复图像质量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Engineering Science and Technology-An International Journal-Jestech
Engineering Science and Technology-An International Journal-Jestech Materials Science-Electronic, Optical and Magnetic Materials
CiteScore
11.20
自引率
3.50%
发文量
153
审稿时长
22 days
期刊介绍: Engineering Science and Technology, an International Journal (JESTECH) (formerly Technology), a peer-reviewed quarterly engineering journal, publishes both theoretical and experimental high quality papers of permanent interest, not previously published in journals, in the field of engineering and applied science which aims to promote the theory and practice of technology and engineering. In addition to peer-reviewed original research papers, the Editorial Board welcomes original research reports, state-of-the-art reviews and communications in the broadly defined field of engineering science and technology. The scope of JESTECH includes a wide spectrum of subjects including: -Electrical/Electronics and Computer Engineering (Biomedical Engineering and Instrumentation; Coding, Cryptography, and Information Protection; Communications, Networks, Mobile Computing and Distributed Systems; Compilers and Operating Systems; Computer Architecture, Parallel Processing, and Dependability; Computer Vision and Robotics; Control Theory; Electromagnetic Waves, Microwave Techniques and Antennas; Embedded Systems; Integrated Circuits, VLSI Design, Testing, and CAD; Microelectromechanical Systems; Microelectronics, and Electronic Devices and Circuits; Power, Energy and Energy Conversion Systems; Signal, Image, and Speech Processing) -Mechanical and Civil Engineering (Automotive Technologies; Biomechanics; Construction Materials; Design and Manufacturing; Dynamics and Control; Energy Generation, Utilization, Conversion, and Storage; Fluid Mechanics and Hydraulics; Heat and Mass Transfer; Micro-Nano Sciences; Renewable and Sustainable Energy Technologies; Robotics and Mechatronics; Solid Mechanics and Structure; Thermal Sciences) -Metallurgical and Materials Engineering (Advanced Materials Science; Biomaterials; Ceramic and Inorgnanic Materials; Electronic-Magnetic Materials; Energy and Environment; Materials Characterizastion; Metallurgy; Polymers and Nanocomposites)
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