Deposition Distribution and Thermal Resistance Analysis of Fins in Heat Exchangers

IF 4.3 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Weigang Xu, Shijian Zhang, Quan Yang, Lei Zhang, Chongsheng Ge, Ao Wang, Shi Bu, Weibing Lv, Lin Zhang
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引用次数: 0

Abstract

The deposition of fly ash on the heat exchanger will reduce the heat transfer efficiency of the system. This article conducted experiments and simulations on the deposition, exploring the effects of velocity, particle size on the deposition position. In addition, deposition density distribution was demonstrated, the calculation method of fin thermal resistance was improved, and the efficiency of fins was also calculated. The results showed that deposition decreased with velocity increasing, and the simulation results were in good agreement with the experimental results. The deposition distribution of the first section of the fin is unimodal, and the maximum deposition value approaches the peak of the fin. The distribution of the second section of the fin becomes bimodal with increasing velocity. In addition, as the speed increases, due to the decrease in deposition mass, the thermal resistance decreases by 53.2% and the fin efficiency increases by 8.82%.
热交换器鳍片的沉积分布和热阻分析
粉煤灰在热交换器上的沉积会降低系统的传热效率。本文对沉积进行了实验和模拟,探讨了速度、粒度对沉积位置的影响。此外,还论证了沉积密度分布,改进了翅片热阻的计算方法,并计算了翅片的效率。结果表明,沉积随速度的增加而减少,模拟结果与实验结果吻合良好。翅片第一段的沉积分布呈单峰分布,最大沉积值接近翅片的峰值。随着速度的增加,翅片第二段的沉积分布变成了双峰分布。此外,随着速度的增加,由于沉积质量的减少,热阻降低了 53.2%,翅片效率提高了 8.82%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
7.20
自引率
4.30%
发文量
567
期刊介绍: ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/​Abstracted: Web of Science SCIE Scopus CAS INSPEC Portico
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