Osama A. Almulla, D. Thrimawithana, Grant A. Covic, Seho Kim
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引用次数: 0
Abstract
This article details the design process for a new three‐phase coil array. All of the coils are made to be mutually decoupled from one another which is achieved by introducing a high reluctance path in the ferrite structure for mutual flux using an airgap in addition to controlling the coil overlap. Simulation and experimental results of a matched three‐phase primary and secondary coupler, designed using the proposed novel decoupling mechanism, are presented to show that the high reluctance path introduced to decouple the coils still allows the main couplings to be maintained within an acceptable range. In contrast, negligible interphase couplings between coils in the primary or secondary were observed. Effective coupling, voltage and uncompensated power measurements are shown to verify the design is able to meet SAE J2954 WPT3 requirements. Finally, the leakage magnetic flux density, simulated under WPT3 conditions, shows that its RMS value remains significantly less than 27 µT at a 800 mm distance from the centre of the secondary coupler.
期刊介绍:
IET Power Electronics aims to attract original research papers, short communications, review articles and power electronics related educational studies. The scope covers applications and technologies in the field of power electronics with special focus on cost-effective, efficient, power dense, environmental friendly and robust solutions, which includes:
Applications:
Electric drives/generators, renewable energy, industrial and consumable applications (including lighting, welding, heating, sub-sea applications, drilling and others), medical and military apparatus, utility applications, transport and space application, energy harvesting, telecommunications, energy storage management systems, home appliances.
Technologies:
Circuits: all type of converter topologies for low and high power applications including but not limited to: inverter, rectifier, dc/dc converter, power supplies, UPS, ac/ac converter, resonant converter, high frequency converter, hybrid converter, multilevel converter, power factor correction circuits and other advanced topologies.
Components and Materials: switching devices and their control, inductors, sensors, transformers, capacitors, resistors, thermal management, filters, fuses and protection elements and other novel low-cost efficient components/materials.
Control: techniques for controlling, analysing, modelling and/or simulation of power electronics circuits and complete power electronics systems.
Design/Manufacturing/Testing: new multi-domain modelling, assembling and packaging technologies, advanced testing techniques.
Environmental Impact: Electromagnetic Interference (EMI) reduction techniques, Electromagnetic Compatibility (EMC), limiting acoustic noise and vibration, recycling techniques, use of non-rare material.
Education: teaching methods, programme and course design, use of technology in power electronics teaching, virtual laboratory and e-learning and fields within the scope of interest.
Special Issues. Current Call for papers:
Harmonic Mitigation Techniques and Grid Robustness in Power Electronic-Based Power Systems - https://digital-library.theiet.org/files/IET_PEL_CFP_HMTGRPEPS.pdf