Design and analysis of a decoupled three‐phase coil array for inductive power transfer systems

IF 1.7 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Osama A. Almulla, D. Thrimawithana, Grant A. Covic, Seho Kim
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Abstract

This article details the design process for a new three‐phase coil array. All of the coils are made to be mutually decoupled from one another which is achieved by introducing a high reluctance path in the ferrite structure for mutual flux using an airgap in addition to controlling the coil overlap. Simulation and experimental results of a matched three‐phase primary and secondary coupler, designed using the proposed novel decoupling mechanism, are presented to show that the high reluctance path introduced to decouple the coils still allows the main couplings to be maintained within an acceptable range. In contrast, negligible interphase couplings between coils in the primary or secondary were observed. Effective coupling, voltage and uncompensated power measurements are shown to verify the design is able to meet SAE J2954 WPT3 requirements. Finally, the leakage magnetic flux density, simulated under WPT3 conditions, shows that its RMS value remains significantly less than 27 µT at a 800 mm distance from the centre of the secondary coupler.
设计和分析用于电感式功率传输系统的去耦三相线圈阵列
本文详细介绍了新型三相线圈阵列的设计过程。除了控制线圈重叠外,还通过在铁氧体结构中引入高磁阻路径,利用气隙实现互通,从而使所有线圈相互去耦。本文介绍了利用拟议的新型去耦机制设计的匹配三相初级和次级耦合器的仿真和实验结果,结果表明,为使线圈去耦而引入的高磁阻路径仍可使主耦合保持在可接受的范围内。相比之下,初级或次级线圈之间的相间耦合可以忽略不计。有效耦合、电压和未补偿功率测量结果表明,该设计能够满足 SAE J2954 WPT3 的要求。最后,在 WPT3 条件下模拟的漏磁通密度显示,在距离次级耦合器中心 800 毫米处,其有效值仍明显小于 27 µT。
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来源期刊
IET Power Electronics
IET Power Electronics ENGINEERING, ELECTRICAL & ELECTRONIC-
CiteScore
5.50
自引率
10.00%
发文量
195
审稿时长
5.1 months
期刊介绍: IET Power Electronics aims to attract original research papers, short communications, review articles and power electronics related educational studies. The scope covers applications and technologies in the field of power electronics with special focus on cost-effective, efficient, power dense, environmental friendly and robust solutions, which includes: Applications: Electric drives/generators, renewable energy, industrial and consumable applications (including lighting, welding, heating, sub-sea applications, drilling and others), medical and military apparatus, utility applications, transport and space application, energy harvesting, telecommunications, energy storage management systems, home appliances. Technologies: Circuits: all type of converter topologies for low and high power applications including but not limited to: inverter, rectifier, dc/dc converter, power supplies, UPS, ac/ac converter, resonant converter, high frequency converter, hybrid converter, multilevel converter, power factor correction circuits and other advanced topologies. Components and Materials: switching devices and their control, inductors, sensors, transformers, capacitors, resistors, thermal management, filters, fuses and protection elements and other novel low-cost efficient components/materials. Control: techniques for controlling, analysing, modelling and/or simulation of power electronics circuits and complete power electronics systems. Design/Manufacturing/Testing: new multi-domain modelling, assembling and packaging technologies, advanced testing techniques. Environmental Impact: Electromagnetic Interference (EMI) reduction techniques, Electromagnetic Compatibility (EMC), limiting acoustic noise and vibration, recycling techniques, use of non-rare material. Education: teaching methods, programme and course design, use of technology in power electronics teaching, virtual laboratory and e-learning and fields within the scope of interest. Special Issues. Current Call for papers: Harmonic Mitigation Techniques and Grid Robustness in Power Electronic-Based Power Systems - https://digital-library.theiet.org/files/IET_PEL_CFP_HMTGRPEPS.pdf
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