Exploring Influential Factors Affecting Baseplate Distortion and Residual Stress in Insulated-Gate Bipolar Transistor (IGBT) Modules During Reflow Soldering

IF 2.2 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Electronic Materials Pub Date : 2024-08-01 DOI:10.1007/s11664-024-11341-0

Shang Gao, Chunzhuang Teng, Haoxiang Wang, Honggang Li, Renke Kang

{"title":"Exploring Influential Factors Affecting Baseplate Distortion and Residual Stress in Insulated-Gate Bipolar Transistor (IGBT) Modules During Reflow Soldering","authors":"Shang Gao, Chunzhuang Teng, Haoxiang Wang, Honggang Li, Renke Kang","doi":"10.1007/s11664-024-11341-0","DOIUrl":null,"url":null,"abstract":"<p>The welding of a direct-bonded copper (DBC) substrate to the baseplate in insulated-gate bipolar transistor (IGBT) modules often induces distortion and residual stress within the baseplate, consequently impacting the operational reliability of the IGBT module. Therefore, a comprehensive analysis of the factors influencing baseplate distortion and residual stress during the reflow soldering process is imperative. This study employs a finite element simulation model to investigate the effects of varying thicknesses of IGBT module components, reflow temperature curve settings, and types of material on baseplate distortion and residual stress. The simulation results highlight that the material of the IGBT module components exerts the most substantial influence on baseplate distortion and residual stress, followed by component thickness, whereas the impact of the reflow temperature curve setting is comparatively minor. The analysis of these influencing factors offers valuable insights for optimizing component thickness selection, material choices for IGBT modules, and reflow temperature curve settings. Moreover, it serves as a practical guide for enhancing production processes and minimizing associated costs.</p><h3 data-test=\"abstract-sub-heading\">Graphical Abstract</h3>\n","PeriodicalId":626,"journal":{"name":"Journal of Electronic Materials","volume":"152 1","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2024-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s11664-024-11341-0","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

The welding of a direct-bonded copper (DBC) substrate to the baseplate in insulated-gate bipolar transistor (IGBT) modules often induces distortion and residual stress within the baseplate, consequently impacting the operational reliability of the IGBT module. Therefore, a comprehensive analysis of the factors influencing baseplate distortion and residual stress during the reflow soldering process is imperative. This study employs a finite element simulation model to investigate the effects of varying thicknesses of IGBT module components, reflow temperature curve settings, and types of material on baseplate distortion and residual stress. The simulation results highlight that the material of the IGBT module components exerts the most substantial influence on baseplate distortion and residual stress, followed by component thickness, whereas the impact of the reflow temperature curve setting is comparatively minor. The analysis of these influencing factors offers valuable insights for optimizing component thickness selection, material choices for IGBT modules, and reflow temperature curve settings. Moreover, it serves as a practical guide for enhancing production processes and minimizing associated costs.

Graphical Abstract

Abstract Image

查看原文本刊更多论文

探索回流焊接过程中影响绝缘栅双极晶体管 (IGBT) 模块基板变形和残余应力的影响因素

在绝缘栅双极晶体管（IGBT）模块中，将直接键合铜（DBC）基板焊接到基板上往往会引起基板变形和残余应力，从而影响 IGBT 模块的运行可靠性。因此，全面分析回流焊接过程中影响基板变形和残余应力的因素势在必行。本研究采用有限元仿真模型，研究不同厚度的 IGBT 模块元件、回流焊温度曲线设置和材料类型对基板变形和残余应力的影响。仿真结果表明，IGBT 模块元件的材料对基板变形和残余应力的影响最大，其次是元件厚度，而回流焊温度曲线设置的影响相对较小。对这些影响因素的分析为优化元件厚度选择、IGBT 模块材料选择和回流焊温度曲线设置提供了宝贵的见解。此外，它还可作为提高生产工艺和最大限度降低相关成本的实用指南。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Journal of Electronic Materials 工程技术-材料科学：综合

CiteScore

4.10

自引率

4.80%

发文量

693

审稿时长

3.8 months

期刊介绍： The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications. Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field. A journal of The Minerals, Metals & Materials Society.