High‐throughput in‐memory bitwise computing based on a coupled dual‐SRAM array with independent operands

IF 1.8 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Hongbiao Wu, Zhiting Lin, Xiulong Wu, Qiang Zhao, Wenjuan Lu, Chunyu Peng
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引用次数: 0

Abstract

The successful implementation of artificial intelligence algorithms depends on the capacity to execute numerous repeated operations, which, in turn, requires systems with high data throughput. Although emerging computing‐in‐memory (CIM) eliminates the need for frequent data transfer between the memory and processing blocks and enables parallel activation of multiple rows, the traditional structure, where each row has only one identical input value, significantly limits its further application. To solve this problem, this study proposes a dual‐SRAM CIM architecture in which two SRAM arrays are coupled such that all operands are different, thus rendering the use of CIM considerably more flexible. The proposed dual‐SRAM array was implemented through a 55‐nm process, essentially delivering a frequency of 361 MHz for a 1.2‐V supply and energy efficiency of 161 TOPS/W at 0.9 V supply.
基于具有独立操作数的耦合双 SRAM 阵列的高吞吐量内存内位运算
人工智能算法的成功实施取决于执行大量重复操作的能力,而这反过来又要求系统具有较高的数据吞吐量。虽然新兴的内存计算(CIM)无需在内存和处理块之间频繁传输数据,并可实现多行并行激活,但每行只有一个相同输入值的传统结构极大地限制了它的进一步应用。为解决这一问题,本研究提出了一种双 SRAM CIM 结构,其中两个 SRAM 阵列耦合在一起,使所有操作数都不同,从而大大提高了 CIM 的使用灵活性。所提出的双 SRAM 阵列是通过 55 纳米工艺实现的,在 1.2 V 电源条件下频率可达 361 MHz,在 0.9 V 电源条件下能效为 161 TOPS/W。
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来源期刊
International Journal of Circuit Theory and Applications
International Journal of Circuit Theory and Applications 工程技术-工程:电子与电气
CiteScore
3.60
自引率
34.80%
发文量
277
审稿时长
4.5 months
期刊介绍: The scope of the Journal comprises all aspects of the theory and design of analog and digital circuits together with the application of the ideas and techniques of circuit theory in other fields of science and engineering. Examples of the areas covered include: Fundamental Circuit Theory together with its mathematical and computational aspects; Circuit modeling of devices; Synthesis and design of filters and active circuits; Neural networks; Nonlinear and chaotic circuits; Signal processing and VLSI; Distributed, switched and digital circuits; Power electronics; Solid state devices. Contributions to CAD and simulation are welcome.
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