Packing simulation and analysis applied to a thermoplastic composite recycling process

IF 2.6 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Awen Bruneau, François Mahé, Christophe Binetruy, Sébastien Comas-Cardona, Charlotte Landry, Nelly Durand
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引用次数: 0

Abstract

A numerical model of packing applied to rigid objects is presented. It aims at describing a random stack of polymer composite chips in order to model the packing step of an existing recycling technique. The geometric properties of the stack play a major role in the mechanical properties of the recycled products. Short, simple and effective geometric descriptors of the stack are proposed. Their ability to differentiate random stacks is illustrated with an example. Then, a validation is proposed based on experimental data obtained from a bench specially designed for this work. The tests consist in the free fall of square chips. Finally, the developed model is compared to other models (free fall and packing of fibers) in order to enforce its relevance in the simulation of packing of rigid objects.
应用于热塑性复合材料回收工艺的包装模拟和分析
本文介绍了一种适用于刚性物体的包装数值模型。该模型旨在描述聚合物复合芯片的随机堆栈,以模拟现有回收技术中的堆积步骤。堆栈的几何特性对回收产品的机械特性起着重要作用。我们提出了简短、简单而有效的堆栈几何描述符。通过一个例子说明了这些描述符区分随机堆垛的能力。然后,根据专门为这项工作设计的工作台获得的实验数据,提出了验证方法。测试包括方形芯片的自由下落。最后,将所开发的模型与其他模型(自由落体和纤维包装)进行比较,以加强其在刚性物体包装模拟中的相关性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Frontiers in Materials
Frontiers in Materials Materials Science-Materials Science (miscellaneous)
CiteScore
4.80
自引率
6.20%
发文量
749
审稿时长
12 weeks
期刊介绍: Frontiers in Materials is a high visibility journal publishing rigorously peer-reviewed research across the entire breadth of materials science and engineering. This interdisciplinary open-access journal is at the forefront of disseminating and communicating scientific knowledge and impactful discoveries to researchers across academia and industry, and the public worldwide. Founded upon a research community driven approach, this Journal provides a balanced and comprehensive offering of Specialty Sections, each of which has a dedicated Editorial Board of leading experts in the respective field.
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