Experimental and FEA Simulations Using ANSYS on the Mechanical Properties of Laminated Object Manufacturing (LOM) 3D-Printed Woven Jute Fiber-Reinforced PLA Laminates

IF 4.3 3区材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC

ACS Applied Electronic Materials Pub Date : 2024-07-17 DOI:10.3390/jmmp8040152

Sazidur Shahriar, Lai Jiang, Jaejong Park, Md Shariful Islam, Bryan Perez, Xiaobo Peng

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Abstract

The mechanical properties of woven jute fiber-reinforced PLA polymer laminates additively manufactured through Laminated Object Manufacturing (LOM) technology are simulated using the finite element method in this work. Woven jute fiber reinforcements are used to strengthen bio-thermoplastic PLA polymers in creating highly biodegradable composite structures that can serve as one of the environmentally friendly alternatives for synthetic composites. A LOM 3D printer prototype was designed and built by the authors. All woven jute/PLA biocomposite laminated specimens made using the built prototype in this study had their tensile and flexural properties measured using ASTM test standards. These laminated structures were modeled using the ANSYS Mechanical Composite PrepPost (ACP) module, and then both testing processes were simulated using the experimentally measured input values. The FEA simulation results indicated a close match with experimental results, with a maximum difference of 9.18%. This study served as an exemplary case study using the FEA method to predict the mechanical behaviors of biocomposite laminate materials made through a novel manufacturing process.

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使用 ANSYS 对层压物体制造 (LOM) 三维打印黄麻纤维增强聚乳酸层压板的力学性能进行实验和有限元分析模拟

本研究采用有限元法模拟了通过层状物体制造（LOM）技术添加制造的编织黄麻纤维增强聚乳酸聚合物层压板的机械性能。编织黄麻纤维增强材料可用于增强生物热塑性聚乳酸聚合物，从而制造出高度可生物降解的复合材料结构，作为合成复合材料的环保替代品之一。作者设计并制造了一台 LOM 3D 打印机原型。在本研究中，使用所建原型制作的所有编织黄麻/PLA 生物复合材料层压试样均采用 ASTM 测试标准测量了其拉伸和弯曲性能。使用 ANSYS Mechanical Composite PrepPost (ACP) 模块对这些层压结构进行建模，然后使用实验测量的输入值对两个测试过程进行模拟。有限元模拟结果表明与实验结果非常接近，最大差异为 9.18%。这项研究是利用有限元分析方法预测通过新型制造工艺制成的生物复合材料层压板机械性能的示范性案例研究。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

ACS Applied Electronic Materials Multiple-

CiteScore

7.20

自引率

4.30%

发文量

567

期刊介绍： ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/Abstracted： Web of Science SCIE Scopus CAS INSPEC Portico