High-precision flexible sweat self-collection sensor for mental stress evaluation

IF 12.3 1区材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC

npj Flexible Electronics Pub Date : 2024-07-29 DOI:10.1038/s41528-024-00333-z

Chenhao Wang, Zhengyu Wang, Wei Wei, Zhenjie Zhang, Anne Ailina Li, Guanghao Huang, Xian Li, Shuzhi Sam Ge, Lianqun Zhou, Hui Kong

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Abstract

As a stress hormone existing in the human body, cortisol can reflect the psychological stress and health status in daily life, and is a potential biomarker of the body’s stress response. To effectively collect sweat and accurately identify the target, this paper reports a flexible wearable cortisol detection device with outstanding reliability and sensitivity. Molecular imprinted polymer (MIP) ensures cortisol specificity. And carbon nanotubes (CNT) on electrodes increase sensitivity, expanding the detection range to 10−3 to 104 nM, with sensitivity at 189.2 nA/lg(nM). In addition, porous chitosan hydrogel (PCSH) collects sweat effectively, its adhesive properties and 80% swelling rate offer a low-cost alternative to microfluidics. Flexible printed circuit board (FPCB) and serpentine electrode (SE) ensure device durability. This non-invasive, highly sensitive device offers a novel method for mental stress monitoring and clinical diagnosis, advancing human physiological state monitoring.

Abstract Image

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用于精神压力评估的高精度柔性汗液自采集传感器

皮质醇作为一种存在于人体内的应激激素，可以反映日常生活中的心理压力和健康状况，是人体应激反应的潜在生物标志物。为了有效采集汗液并准确识别目标，本文报道了一种具有出色可靠性和灵敏度的柔性可穿戴皮质醇检测装置。分子印迹聚合物（MIP）确保了皮质醇的特异性。电极上的碳纳米管（CNT）提高了灵敏度，将检测范围扩大到 10-3 至 104 nM，灵敏度为 189.2 nA/lg(nM)。此外，多孔壳聚糖水凝胶（PCSH）能有效收集汗液，其粘合特性和 80% 的溶胀率为微流体技术提供了低成本的替代品。柔性印刷电路板（FPCB）和蛇形电极（SE）确保了设备的耐用性。这种无创、高灵敏度的设备为精神压力监测和临床诊断提供了一种新方法，推动了人体生理状态监测的发展。

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来源期刊

npj Flexible Electronics Multiple-

CiteScore

17.10

自引率

4.80%

发文量

审稿时长

6 weeks

期刊介绍： npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.